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    Optical chip and method for producing an optical chip having a reinforced structure
    1.
    发明授权
    Optical chip and method for producing an optical chip having a reinforced structure 失效
    光学芯片及具有加强结构的光学芯片的制造方法

    公开(公告)号：US07016557B2

    公开(公告)日：2006-03-21

    申请号：US10380445

    申请日：2001-09-12

    申请人： Bernhard A. Deutsch ,  Angela Rief ,  Wolfgang Schweiker ,  Frank Zimmer

    发明人： Bernhard A. Deutsch ,  Angela Rief ,  Wolfgang Schweiker ,  Frank Zimmer

    IPC分类号： G02B6/12

    CPC分类号： G02B6/12 ,  G02B6/30 ,  G02B6/42 ,  G02B2006/12135 ,  G02F1/0147

    摘要： The invention relates to an optical chip and to a method for producing an optical chip having a reinforced structure. The chip has a substrate, optical waveguides arranged on the surface of said substrate, and at least one optical structure for influencing the optical properties of the optical waveguides, and an interconnected laminar reinforcing or stiffening structure constructed in the form of a cross which is arranged centrally on the substrate with the provision of diametrically opposite cut-outs.

    摘要翻译： 本发明涉及一种光学芯片以及一种具有增强结构的光学芯片的制造方法。 芯片具有衬底，布置在所述衬底的表面上的光波导和用于影响光波导的光学特性的至少一个光学结构，以及以十字形式构造的互连的层状加强或加强结构， 集中在基板上，并提供完全相反的切口。

    Optical fiber coupling unit and optical waveguide arrangement, and method of producing an optical fiber coupling unit
    2.
    发明授权
    Optical fiber coupling unit and optical waveguide arrangement, and method of producing an optical fiber coupling unit 有权
    光纤耦合单元和光波导布置，以及光纤耦合单元的制造方法

    公开(公告)号：US06786648B2

    公开(公告)日：2004-09-07

    申请号：US10047569

    申请日：2002-01-15

    申请人： Angela Rief ,  Wolfgang Schweiker ,  Frank Zimmer

    发明人： Angela Rief ,  Wolfgang Schweiker ,  Frank Zimmer

    IPC分类号： G02B636

    CPC分类号： G02B6/3835 ,  G02B6/30 ,  G02B6/3822 ,  G02B6/3839 ,  G02B6/3854

    摘要： Optical fiber coupling unit and optical waveguide arrangement, and method of producing an optical fiber coupling unit. The optical fiber coupling unit 1 has: an optical fiber 2, which has a fiber core 4 and a fiber cladding 6 surrounding the fiber core 4, and a sleeve 8, which is arranged on an end portion of the optical fiber 2 and terminates flush with the associated extreme end 14 of the optical fiber 2, so that on this extreme end 14 there is formed a continuous coupling face 16, with which the optical fiber coupling unit 1 can be placed against an optical waveguide component to establish an optical coupling.

    摘要翻译： 光纤耦合单元和光波导布置，以及光纤耦合单元的制造方法。 光纤耦合单元1具有：光纤2，其具有纤维芯4和围绕纤维芯4的纤维包层6和套筒8，套筒8布置在光纤2的端部上并终止齐平 与光纤2的相关联的末端14，使得在该最终端14上形成有连续的耦合面16，光纤耦合单元1可以抵靠光波导部件放置在其上以建立光耦合。

    Method for producing an optical splitter, and optical splitter
    4.
    发明授权
    Method for producing an optical splitter, and optical splitter 有权
    光分路器的制造方法以及光分路器

    公开(公告)号：US07555176B2

    公开(公告)日：2009-06-30

    申请号：US11895011

    申请日：2007-08-22

    申请人： Franz Draxler ,  Klaus Hartkorn ,  Markus Meinelt ,  Angela Rief ,  Wolfgang Schweiker

    发明人： Franz Draxler ,  Klaus Hartkorn ,  Markus Meinelt ,  Angela Rief ,  Wolfgang Schweiker

    IPC分类号： G02B6/26

    CPC分类号： B32B37/12 ,  B32B2305/342 ,  B32B2310/0831 ,  B32B2551/00 ,  G02B6/30 ,  G02B6/3636 ,  G02B6/3652 ,  G02B2006/1215

    摘要： An optical splitter has an optical chip, in which a conductor track is arranged on a carrier substrate, wherein a conductor track section of the conductor track running from a first side of the chip branches into different conductor track sections which run to a second side of the chip via a plurality of branching nodes. An optical waveguide section of an optical waveguide is bonded at the first side of the chip by means of an adhesive material. Correspondingly, optical waveguide sections are bonded on the second side of the chip by means of an adhesive material. In order to reinforce the fixing, glass plates are arranged over and under the optical waveguides, said glass plates being bonded to the optical chip at the respective lateral surfaces.

    摘要翻译： 光分路器具有其中导体轨道布置在载体基板上的光学芯片，其中从芯片的第一侧延伸的导体轨道的导体轨道部分分支到不同的导体轨道部分，该导体轨道部分运行到 该芯片经由多个分支节点。 光波导的光波导部分通过粘合材料在芯片的第一侧接合。 相应地，光波导部分通过粘合材料结合在芯片的第二侧上。 为了加强固定，玻璃板布置在光波导上方和下方，所述玻璃板在相应的侧表面处结合到光学芯片。