发明授权
- 专利标题： Non-contact data carrier and method of fabricating the same
- 专利标题（中）： 非接触式数据载体及其制造方法
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申请号： US10856991申请日： 2004-06-01
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公开(公告)号： US07018844B2公开(公告)日： 2006-03-28
- 发明人: Hiroshi Yagi , Masanao Watanabe , Takeshi Sekiguchi , Chikao Ikenaga , Makoto Nakamura
- 申请人： Hiroshi Yagi , Masanao Watanabe , Takeshi Sekiguchi , Chikao Ikenaga , Makoto Nakamura
- 申请人地址： JP Tokyo
- 专利权人： Dai Nippon Printing Co., Ltd.
- 当前专利权人： Dai Nippon Printing Co., Ltd.
- 当前专利权人地址： JP Tokyo
- 代理机构： Oliff & Berridge, PLC
- 优先权： JP2001-399278 20011228
- 主分类号： H01L21/44
- IPC分类号： H01L21/44 ; H01L21/46
摘要：
A non-contact data carrier includes a semiconductor device (11), a coil antenna (12), and a sealing resin coating (13) sealing the semiconductor device (11) and the coil antenna (12) therein. The electrodes (11a) of the semiconductor device (11) are connected to the opposite ends (12a, 12b) of the coil antenna (12) by wires (14). The surface of the coil antenna (12) opposite to the sealing resin coating (13) is covered with a protective layer (16) for protection.
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