公开(公告)号：US06774470B2

公开(公告)日：2004-08-10

申请号：US10327657

申请日：2002-12-24

申请人： Hiroshi Yagi ,  Masanao Watanabe ,  Takeshi Sekiguchi ,  Chikao Ikenaga ,  Makoto Nakamura

发明人： Hiroshi Yagi ,  Masanao Watanabe ,  Takeshi Sekiguchi ,  Chikao Ikenaga ,  Makoto Nakamura

IPC分类号： H01L2302

CPC分类号： G06K19/0775 ,  G06K19/07749 ,  H01F5/003 ,  H01F5/06 ,  H01F41/042 ,  H01L21/568 ,  H01L23/49855 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/451 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48265 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30107 ,  Y10T436/17 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A non-contact data carrier includes a semiconductor device (11), a coil antenna (12), and a sealing resin coating (13) sealing the semiconductor device (11) and the coil antenna (12) therein. The electrodes (11a) of the semiconductor device (11) are connected to the opposite ends (12a, 12b) of the coil antenna (12) by wires (14). The surface of the coil antenna (12) opposite to the sealing resin coating (13) is covered with a protective layer (16) for protection.

摘要翻译： 非接触式数据载体包括半导体器件（11），线圈天线（12）和将半导体器件（11）和线圈天线（12）密封在其中的密封树脂涂层（13）。 半导体器件（11）的电极（11a）通过导线（14）连接到线圈天线（12）的相对端（12a，12b）。 与密封树脂涂层（13）相对的线圈天线（12）的表面被保护层（16）覆盖以进行保护。

公开(公告)号：US07018844B2

公开(公告)日：2006-03-28

申请号：US10856991

申请日：2004-06-01

申请人： Hiroshi Yagi ,  Masanao Watanabe ,  Takeshi Sekiguchi ,  Chikao Ikenaga ,  Makoto Nakamura

发明人： Hiroshi Yagi ,  Masanao Watanabe ,  Takeshi Sekiguchi ,  Chikao Ikenaga ,  Makoto Nakamura

IPC分类号： H01L21/44 ,  H01L21/46

CPC分类号： G06K19/0775 ,  G06K19/07749 ,  H01F5/003 ,  H01F5/06 ,  H01F41/042 ,  H01L21/568 ,  H01L23/49855 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/451 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48265 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30107 ,  Y10T436/17 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A non-contact data carrier includes a semiconductor device (11), a coil antenna (12), and a sealing resin coating (13) sealing the semiconductor device (11) and the coil antenna (12) therein. The electrodes (11a) of the semiconductor device (11) are connected to the opposite ends (12a, 12b) of the coil antenna (12) by wires (14). The surface of the coil antenna (12) opposite to the sealing resin coating (13) is covered with a protective layer (16) for protection.

摘要翻译： 非接触式数据载体包括半导体器件（11），线圈天线（12）和将半导体器件（11）和线圈天线（12）密封在其中的密封树脂涂层（13）。 半导体器件（11）的电极（11a）通过导线（14）连接到线圈天线（12）的相对端（12a，12b）。 与密封树脂涂层（13）相对的线圈天线（12）的表面被保护层（16）覆盖以进行保护。

公开(公告)号：US06359221B1

公开(公告)日：2002-03-19

申请号：US09123558

申请日：1998-07-29

申请人： Syuichi Yamada ,  Makoto Nakamura ,  Takayuki Takeshita ,  Hiroshi Yagi

发明人： Syuichi Yamada ,  Makoto Nakamura ,  Takayuki Takeshita ,  Hiroshi Yagi

IPC分类号： H01L2300

CPC分类号： H01L21/6835 ,  H01L21/4828 ,  H01L23/3114 ,  H01L23/4951 ,  H01L23/49548 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L2221/68377 ,  H01L2224/05599 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2224/85399 ,  H01L2224/85444 ,  H01L2224/85464 ,  H01L2224/92147 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/1433 ,  H01L2924/15311 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49169 ,  Y10T29/49172 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： There is disclosed a resin-sealed semiconductor device in which plural circuit portions integrally having inner and outer terminals are arranged two-dimensionally substantially in a plane and electrically independent of one another, and have leads for integrally interconnecting the inner and outer terminals, surfaces of the circuit portions are semiconductor element mounted faces with the inner and outer terminals and the leads forming one plane, the inner terminals and the leads are thinner than the outer terminals, back surfaces of the circuit portions are provided with terminal faces of the inner and outer terminals, a terminal mounted face of the semiconductor element is mounted via an insulating layer onto the semiconductor element mounted faces of the circuit portions, and the semiconductor element terminals are electrically connected with wires to the terminal faces of the inner terminal, and the whole is sealed with a resin in such a manner that the outer terminals are partially exposed to the outside. An occupation ratio of the semiconductor element in the semiconductor device is enhanced, the semiconductor device can be miniaturized, and a mounting density onto a circuit board can be enhanced. By forming outer electrodes on the outer terminals, multiple pins can further be provided, which is difficult with a small-sized semiconductor device such as conventional TSOP and the like.

摘要翻译： 公开了一种树脂密封半导体器件，其中整体地具有内端子和外端子的多个电路部分基本上彼此平行地布置并且彼此电独立地布置，并且具有用于将内部和外部端子， 电路部分是具有内端和外端的半导体元件安装面，并且引线形成一个平面，内端子和引线比外端子薄，电路部分的后表面设置有内外端子 端子，半导体元件的端子安装面通过绝缘层安装在电路部分的半导体元件安装面上，半导体元件端子与导线电连接到内部端子的端子面，整体上是 用树脂密封，外部端子是偏心的 y暴露在外面。 半导体器件中的半导体元件的占有率增加，可以使半导体器件小型化，并且可以提高对电路板的安装密度。 通过在外部端子上形成外部电极，可以进一步提供多个引脚，这对于诸如常规TSOP等的小尺寸半导体器件是困难的。

公开(公告)号：US06465734B2

公开(公告)日：2002-10-15

申请号：US09804149

申请日：2001-03-13

申请人： Syuichi Yamada ,  Makoto Nakamura ,  Takayuki Takeshita ,  Hiroshi Yagi

发明人： Syuichi Yamada ,  Makoto Nakamura ,  Takayuki Takeshita ,  Hiroshi Yagi

IPC分类号： H01L2348

CPC分类号： H01L21/6835 ,  H01L21/4828 ,  H01L23/3114 ,  H01L23/4951 ,  H01L23/49548 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L2221/68377 ,  H01L2224/05599 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2224/85399 ,  H01L2224/85444 ,  H01L2224/85464 ,  H01L2224/92147 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/1433 ,  H01L2924/15311 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49169 ,  Y10T29/49172 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： There is disclosed a resin-sealed semiconductor device in which plural circuit portions integrally having inner and outer terminals are arranged two-dimensionally substantially in a plane and electrically independent of one another, and have leads for integrally interconnecting the inner and outer terminals, surfaces of the circuit portions are semiconductor element mounted faces with the inner and outer terminals and the leads forming one plane, the inner terminals and the leads are thinner than the outer terminals, back surfaces of the circuit portions are provided with terminal faces of the inner and outer terminals, a terminal mounted face of the semiconductor element is mounted via an insulating layer onto the semiconductor element mounted faces of the circuit portions, and the semiconductor element terminals are electrically connected with wires to the terminal faces of the inner terminal, and the whole is sealed with a resin in such a manner that the outer terminals are partially exposed to the outside. An occupation ratio of the semiconductor element in the semiconductor device is enhanced, the semiconductor device can be miniaturized, and a mounting density onto a circuit board can be enhanced. By forming outer electrodes on the outer terminals, multiple pins can further be provided, which is difficult with a small-sized semiconductor device such as conventional TSOP and the like.

摘要翻译： 公开了一种树脂密封半导体器件，其中整体地具有内端子和外端子的多个电路部分基本上彼此平行地布置并且彼此电独立地布置，并且具有用于将内部和外部端子， 电路部分是具有内端和外端的半导体元件安装面，并且引线形成一个平面，内端子和引线比外端子薄，电路部分的后表面设置有内外端子 端子，半导体元件的端子安装面通过绝缘层安装在电路部分的半导体元件安装面上，半导体元件端子与导线电连接到内部端子的端子面，整体上是 用树脂密封，外部端子是偏心的 y暴露在外面。 半导体器件中的半导体元件的占有率增加，可以使半导体器件小型化，并且可以提高对电路板的安装密度。 通过在外部端子上形成外部电极，可以进一步提供多个引脚，这对于诸如常规TSOP等的小尺寸半导体器件是困难的。

公开(公告)号：US06658734B2

公开(公告)日：2003-12-09

申请号：US09987855

申请日：2001-11-16

申请人： Syuichi Yamada ,  Makoto Nakamura ,  Takayuki Takeshita ,  Hiroshi Yagi

发明人： Syuichi Yamada ,  Makoto Nakamura ,  Takayuki Takeshita ,  Hiroshi Yagi

IPC分类号： H01R4300

CPC分类号： H01L21/6835 ,  H01L21/4828 ,  H01L23/3114 ,  H01L23/4951 ,  H01L23/49548 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L2221/68377 ,  H01L2224/05599 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2224/85399 ,  H01L2224/85444 ,  H01L2224/85464 ,  H01L2224/92147 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/1433 ,  H01L2924/15311 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49169 ,  Y10T29/49172 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： There is disclosed a resin-sealed semiconductor device in which plural circuit portions integrally having inner and outer terminals are arranged two-dimensionally substantially in a plane and electrically independent of one another, and have leads for integrally interconnecting the inner and outer terminals, surfaces of the circuit portions are semiconductor element mounted faces with the inner and outer terminals and the leads forming one plane, the inner terminals and the leads are thinner than the outer terminals, back surfaces of the circuit portions are provided with terminal faces of the inner and outer terminals, a terminal mounted face of the semiconductor element is mounted via an insulating layer onto the semiconductor element mounted faces of the circuit portions, and the semiconductor element terminals are electrically connected with wires to the terminal faces of the inner terminal, and the whole is sealed with a resin in such a manner that the outer terminals are partially exposed to the outside.

摘要翻译： 公开了一种树脂密封半导体器件，其中整体地具有内端子和外端子的多个电路部分基本上彼此平行地布置并且彼此电独立地布置，并且具有用于将内部和外部端子， 电路部分是具有内端和外端的半导体元件安装面，并且引线形成一个平面，内端子和引线比外端子薄，电路部分的后表面设置有内外端子 端子，半导体元件的端子安装面通过绝缘层安装在电路部分的半导体元件安装面上，半导体元件端子与导线电连接到内部端子的端子面，整体上是 用树脂密封，外部端子是偏心的 y暴露在外面。

公开(公告)号：US06201292B1

公开(公告)日：2001-03-13

申请号：US09052984

申请日：1998-04-01

申请人： Hiroshi Yagi ,  Yoichi Hitomi ,  Makoto Nakamura ,  Masato Sasaki

发明人： Hiroshi Yagi ,  Yoichi Hitomi ,  Makoto Nakamura ,  Masato Sasaki

IPC分类号： H01L23495

CPC分类号： H01L23/49548 ,  H01L21/4828 ,  H01L23/4951 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2221/68377 ,  H01L2224/05554 ,  H01L2224/32057 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/4826 ,  H01L2224/48475 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/85051 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： There is disclosed a resin-sealed semiconductor device in which plural terminal portions each integrally having an inner terminal on a surface and an outer terminal on a rear face are arranged two-dimensionally substantially in a plane electrically independent of one another. A die pad is electrically independently disposed in a substantially middle portion in the plane where the terminal portions are arranged two-dimensionally. A semiconductor element is mounted on the die pad. The inner terminals of the terminal portions are electrically connected via wires to terminals of the semiconductor element, and the entirety is sealed with a resin in such a manner that the outer terminals of the terminal portions are partially exposed to the outside. Therefore, an occupancy ratio of the semiconductor element in the semiconductor device is increased. The semiconductor device can be miniaturized. The mounting density onto a circuit substrate can be enhanced. Also, by forming outer electrodes on the outer terminals, different from the conventional TSOP or another small-sized semiconductor device, multiple pins can be easily provided.

摘要翻译： 公开了一种树脂密封半导体器件，其中，在表面上一体地具有内部端子和后表面上的外部端子的多个端子部分基本上彼此平行地布置在彼此电独立的平面中。 芯片焊盘电气地独立地设置在端子部分被二维布置的平面中的大致中间部分中。 半导体元件安装在管芯焊盘上。 端子部分的内部端子经由导线电连接到半导体元件的端子，并且整体用树脂密封，使得端子部分的外部端部部分地暴露于外部。 因此，半导体器件中的半导体元件的占有率增加。 可以使半导体器件小型化。 可以提高电路基板上的安装密度。 此外，通过在外部端子上形成外部电极，与常规TSOP或另一小型半导体器件不同，可以容易地提供多个引脚。

公开(公告)号：US08902290B2

公开(公告)日：2014-12-02

申请号：US13351799

申请日：2012-01-17

申请人： Hiroshi Yagi ,  Toshiaki Yamada

发明人： Hiroshi Yagi ,  Toshiaki Yamada

IPC分类号： H04N13/00

CPC分类号： H04N13/156

摘要： The data processing unit generates image data such that the camera unit is caused to acquire a plurality of data captured with a focal length changed in response to instructions for imaging operation by an operation unit and three-dimensional display data are generated from the plurality of captured data based on the correlation of focused images which are different according to the focal lengths of the acquired plurality of captured data with the focal length thereof. Since each of the plurality of data captured with a focal length changed is different in a focused image according to the focal length, the plurality of captured data is subjected to the processing for generating three-dimensional display data based on the correlation of a focused image different according to the focal length with the focal length to allow the three-dimensional display data to be generated.

摘要翻译： 数据处理单元生成图像数据，使得摄像机单元被采集获得响应于由操作单元进行的成像操作的指令而改变的焦距所捕获的多个数据，并且从多个捕捉到的多个捕捉到的三维显示数据生成三维显示数据 基于根据所获取的多个捕获数据的焦距与其焦距不同的聚焦图像的相关性的数据。 由于根据焦距在聚焦图像中所改变的多个被拍摄的多个数据中的每一个都是不同的，所以根据聚焦图像的相关性对多个捕获数据进行用于产生三维显示数据的处理 根据具有焦距的焦距不同，以允许生成三维显示数据。

公开(公告)号：US08708932B2

公开(公告)日：2014-04-29

申请号：US13617439

申请日：2012-09-14

申请人： Noriyuki Tamai ,  Katsuhiro Shirakawa ,  Hiroshi Yagi

发明人： Noriyuki Tamai ,  Katsuhiro Shirakawa ,  Hiroshi Yagi

IPC分类号： A61B5/00

CPC分类号： A61M25/09 ,  A61M25/0041 ,  A61M2025/09133 ,  A61M2025/0915 ,  A61M2025/09175

摘要： The guide wire is a guide wire includes a distal portion and a main body portion. This guide wire is provided with a first curve portion; a second curve portion included on the distal side of aforesaid first curve portion and curved to the opposite direction with respect to aforesaid first curve portion; a third curve portion included on the distal side of aforesaid second curve portion and curved to the opposite direction with respect to aforesaid second curve portion, wherein a line contacting with both aforesaid first curve portion and aforesaid third curve portion has an obtuse angle with respect to an axis line of aforesaid main body portion.

摘要翻译： 导丝是包括远侧部分和主体部分的导丝。 该引导线设置有第一曲线部分; 第二曲线部分包括在上述第一曲线部分的远侧上并相对于上述第一曲线部分弯曲到相反方向; 第三曲线部分包括在上述第二曲线部分的远侧上并相对于上述第二曲线部分弯曲到相反方向，其中与上述第一曲线部分和上述第三曲线部分两者接触的线相对于 上述主体部分的轴线。

公开(公告)号：US20130323708A1

公开(公告)日：2013-12-05

申请号：US13392661

申请日：2010-06-30

申请人： Martin Yarmush ,  Basak E. Uygun ,  Mustafa Korkut Uygun ,  Maria Louisa Izamis ,  Alejandro Soto-Gutierrez ,  Herman Tolboom ,  Hiroshi Yagi ,  Carley Shulman ,  John Miles Milwid

发明人： Martin Yarmush ,  Basak E. Uygun ,  Mustafa Korkut Uygun ,  Maria Louisa Izamis ,  Alejandro Soto-Gutierrez ,  Herman Tolboom ,  Hiroshi Yagi ,  Carley Shulman ,  John Miles Milwid

IPC分类号： C12N5/071

CPC分类号： C12N5/067 ,  A01N1/021 ,  A01N1/0247 ,  A61K35/407 ,  A61M1/14

摘要： One aspect of the invention provides a method for harvesting adult cells from an organ. The method includes perfusing the organ with a perfusate and isolating adult cells from the organ, thereby harvesting the adult cells from the organ. Another aspect of the invention provides a method for rehabilitating an organ. The method includes: dividing the organ into a first portion and a second portion, perfusing the first portion with a decellularization medium, isolating adult cells from the second portion, and recellularizing the first portion with a suspension of the adult cells, thereby rehabilitating the organ.

公开(公告)号：US20130211382A1

公开(公告)日：2013-08-15

申请号：US13763423

申请日：2013-02-08

申请人： Takayuki Mouri ,  Hiroshi Yagi

发明人： Takayuki Mouri ,  Hiroshi Yagi

IPC分类号： A61M25/01

CPC分类号： A61M25/0133 ,  A61M25/01 ,  A61M25/02 ,  A61M2025/024

摘要： In one form, a direction changing device is provided including: a first mounting section; and a second mounting section, wherein an axial direction of the first mounting section and an axial direction of the second mounting section intersect each other or are parallel to each other in plan view, and in a condition where a catheter or a sheath introducer in which the catheter is inserted is mounted to the first mounting section and the second mounting section, the catheter or the sheath introducer adopts a curved shape such that a catheter or sheath introducer portion mounted to the first mounting section extends proximally to distally in one direction and a catheter or sheath introducer portion mounted to the second mounting section extends proximally to distally in another direction with the directions being different from each other.

摘要翻译： 在一种形式中，提供了一种方向改变装置，包括：第一安装部; 以及第二安装部，其中，所述第一安装部的轴向方向和所述第二安装部的轴向在平面图中彼此相交或彼此平行，并且在导管或护套导入器的状态下， 插入的导管被安装到第一安装部分和第二安装部分上，导管或护套引入器采用弯曲形状，使得安装到第一安装部分的导管或护套导引器部分沿一个方向向远侧延伸，并且 安装到第二安装部分的导管或鞘引入器部分沿着彼此不同的方向在另一方向上向远侧延伸。