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公开(公告)号：US06774470B2
公开(公告)日：2004-08-10
申请号：US10327657
申请日：2002-12-24
IPC分类号： H01L2302
CPC分类号： G06K19/0775 , G06K19/07749 , H01F5/003 , H01F5/06 , H01F41/042 , H01L21/568 , H01L23/49855 , H01L24/45 , H01L24/48 , H01L2224/451 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48265 , H01L2924/00014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/30107 , Y10T436/17 , H01L2924/00 , H01L2224/05599 , H01L2924/00012
摘要： A non-contact data carrier includes a semiconductor device (11), a coil antenna (12), and a sealing resin coating (13) sealing the semiconductor device (11) and the coil antenna (12) therein. The electrodes (11a) of the semiconductor device (11) are connected to the opposite ends (12a, 12b) of the coil antenna (12) by wires (14). The surface of the coil antenna (12) opposite to the sealing resin coating (13) is covered with a protective layer (16) for protection.
摘要翻译： 非接触式数据载体包括半导体器件（11），线圈天线（12）和将半导体器件（11）和线圈天线（12）密封在其中的密封树脂涂层（13）。 半导体器件（11）的电极（11a）通过导线（14）连接到线圈天线（12）的相对端（12a，12b）。 与密封树脂涂层（13）相对的线圈天线（12）的表面被保护层（16）覆盖以进行保护。
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公开(公告)号：US07018844B2
公开(公告)日：2006-03-28
申请号：US10856991
申请日：2004-06-01
CPC分类号： G06K19/0775 , G06K19/07749 , H01F5/003 , H01F5/06 , H01F41/042 , H01L21/568 , H01L23/49855 , H01L24/45 , H01L24/48 , H01L2224/451 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48265 , H01L2924/00014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/30107 , Y10T436/17 , H01L2924/00 , H01L2224/05599 , H01L2924/00012
摘要： A non-contact data carrier includes a semiconductor device (11), a coil antenna (12), and a sealing resin coating (13) sealing the semiconductor device (11) and the coil antenna (12) therein. The electrodes (11a) of the semiconductor device (11) are connected to the opposite ends (12a, 12b) of the coil antenna (12) by wires (14). The surface of the coil antenna (12) opposite to the sealing resin coating (13) is covered with a protective layer (16) for protection.
摘要翻译： 非接触式数据载体包括半导体器件（11），线圈天线（12）和将半导体器件（11）和线圈天线（12）密封在其中的密封树脂涂层（13）。 半导体器件（11）的电极（11a）通过导线（14）连接到线圈天线（12）的相对端（12a，12b）。 与密封树脂涂层（13）相对的线圈天线（12）的表面被保护层（16）覆盖以进行保护。
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公开(公告)号：US20100113338A1
公开(公告)日：2010-05-06
申请号：US11993580
申请日：2006-06-21
CPC分类号： A61K38/1761 , A61K9/0048
摘要： Disclosed is a novel composition for the treatment of a corneal/conjunctival disease. A prophylactic or therapeutic agent for a corneal/conjunctival disease comprising selenoprotein P as an active ingredient, more specifically a prophylactic or therapeutic agent for a corneal/conjunctival disease such as dry eye, keratoconjunctivitis sicca, superficial punctate keratopathy, corneal erosion or corneal ulcer comprising selenoprotein P as an active ingredient, particularly a prophylactic or therapeutic agent for a corneal/conjuncrtival disease such as dry eye, keratoconjunctivitis sicca, superficial punctate keratopathy, corneal erosion or corneal ulcer accompanied by a corneal/conjunctival epithelial discorder.
摘要翻译： 公开了用于治疗角膜/结膜疾病的新型组合物。 一种用于角膜/结膜疾病的预防或治疗剂，其包含硒蛋白P作为活性成分，更具体地，涉及用于角膜/结膜疾病如干眼症，圆锥形结膜炎丝氨酸，浅表性点状角膜病，角膜侵蚀或角膜溃疡的预防或治疗剂，其包括 硒蛋白P作为活性成分，特别是用于角膜/结膜性疾病例如干眼症，透角圆锥形结膜炎，浅表性点状角膜病变，伴随角膜/结膜上皮发生器的角膜侵蚀或角膜溃疡的预防或治疗剂。
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4.发明授权公开(公告)号：US06583364B1
公开(公告)日：2003-06-24
申请号：US09642638
申请日：2000-08-22
IPC分类号： H05K100
CPC分类号： H05K3/4635 , H01L2224/1147 , H01L2924/01019 , H05K1/0393 , H05K3/005 , H05K3/28 , H05K3/423 , H05K3/4617 , H05K3/4647 , H05K3/4652 , H05K2201/0195 , H05K2201/0355 , H05K2201/09563 , H05K2203/0195 , H05K2203/0285 , H05K2203/1189 , Y10T29/49124 , Y10T29/49126 , Y10T29/49155
摘要： The present invention pertains to a multilayer flexible wiring board. The multilayer flexible wiring board including first and second patterned wiring layers, a resin film interposed between a surface of the first wiring layer and a surface of the second wiring layer, and a bump connected to the surface of the second wiring layer, wherein the resin film is adapted to form an opening when the bump to force into the resin film and an ultrasonic wave is applied to the bump and the bump is left in the opening to electrically connect the top of the bump to the first wiring layer.
摘要翻译： 本发明涉及一种多层柔性布线板。多层挠性布线板包括第一和第二图案化布线层，介于第一布线层的表面和第二布线层的表面之间的树脂膜和连接到 所述第二布线层的表面，其中当所述凸起压入所述树脂膜中时，所述树脂膜适于形成开口，并且超声波被施加到所述凸起，并且所述凸块被留在所述开口中以电连接所述第二布线层的顶部 碰到第一个接线层。
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公开(公告)号：US4323659A
公开(公告)日：1982-04-06
申请号：US212801
申请日：1980-12-04
IPC分类号： C08G59/00 , C08G59/20 , C08G59/30 , C08G59/40 , C08G59/62 , C08L33/00 , C08L33/02 , C08L63/00 , C09J133/04 , C09J163/00 , C09J163/02 , C09J163/04 , H01B3/40 , H05K1/00 , H05K3/38
CPC分类号： H05K3/386 , C08G59/62 , C08L63/00 , C09J163/00 , C09J163/04 , H01B3/40 , H05K1/0393 , H05K2201/012 , H05K2201/0355
摘要： The non-flammable adhesive compositions contain 100 parts by weight of a brominated epoxy resin such as a bisphenol type brominated epoxy resin or a novolak type brominated epoxy resin; 40-80 parts by weight of an acrylic copolymer and 5-20 parts by weight of a brominated polyvinyl phenol, said acrylic copolymer being prepared by copolymerizing (a) 5-35% by weight of acrylonitrile, (b) 0.5-10% by weight of an ethylenically unsaturated compound having at least one functional group selected from carboxyl, hydroxyl and epoxy group, and (c) substantially the balance of an ester obtainable from an alcohol having from 1 to 6 carbon atoms and acrylic acid and/or methacrylic acid.
摘要翻译： 不燃性粘合剂组合物含有100重量份溴化环氧树脂如双酚型溴化环氧树脂或酚醛清漆型溴化环氧树脂; 40-80重量份的丙烯酸共聚物和5-20重量份的溴化聚乙烯基苯酚，所述丙烯酸共聚物通过（a）5-35重量％的丙烯腈，（b）0.5-10重量％的 具有至少一个选自羧基，羟基和环氧基的官能团的烯键式不饱和化合物的重量，和（c）可从具有1至6个碳原子的醇和丙烯酸和/或甲基丙烯酸获得的基本上余量的 。
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公开(公告)号：US20080009063A1
公开(公告)日：2008-01-10
申请号：US11773127
申请日：2007-07-03
申请人： Teruo Okano , Masayuki Yamato , Yoshikatsu Akiyama , Masanao Watanabe , Hiroyuki Naganuma , Masami Nara
发明人： Teruo Okano , Masayuki Yamato , Yoshikatsu Akiyama , Masanao Watanabe , Hiroyuki Naganuma , Masami Nara
IPC分类号： C12N5/02
CPC分类号： C12N5/0068 , C12M25/00 , C12M25/06 , C12N2533/30 , C12N2535/00 , C12N2535/10 , C12N2539/10
摘要： An object of the present invention is to provide a cell culture substrate capable of quickly forming a cell sheet and easily removing the cell sheet after formed. The present invention relates to a cell culture substrate for forming a cell sheet by culturing cells, comprising a plurality of projections each having a top face and depressions formed between the projections, in which the depressions each have an opening whose dimensions are too small for a cell to be cultured to enter and the cell sheet is removable. The present invention further relates to a method of preparing a cell sheet using the substrate and a cell sheet prepared by the method.
摘要翻译： 本发明的目的是提供能够快速形成细胞片并且容易地除去细胞片的细胞培养基材。 本发明涉及用于通过培养细胞形成细胞片的细胞培养基质，所述细胞培养基底包括多个突起，每个突起具有顶表面和在所述突起之间形成的凹陷，其中所述凹陷各自具有尺寸对于 要培养的细胞进入，细胞片是可移除的。 本发明还涉及使用该基材制备细胞片的方法和通过该方法制备的细胞片。
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公开(公告)号：US06991148B2
公开(公告)日：2006-01-31
申请号：US10423978
申请日：2003-04-28
CPC分类号： H05K3/4635 , H01L2224/1147 , H01L2924/01019 , H05K1/0393 , H05K3/005 , H05K3/28 , H05K3/423 , H05K3/4617 , H05K3/4647 , H05K3/4652 , H05K2201/0195 , H05K2201/0355 , H05K2201/09563 , H05K2203/0195 , H05K2203/0285 , H05K2203/1189 , Y10T29/49124 , Y10T29/49126 , Y10T29/49155
摘要： The multilayer flexible wiring board includes first and second patterned wiring layers, a resin film interposed between a surface of the first wiring layer and a surface of the second wiring layer, and a bump connected to the surface of the second wiring layer. The resin film is adapted to form an opening when the bump is forced into the resin film and an ultrasonic wave is applied to the bump. The bump is left in the opening to electrically connect the top of the bump to the first wiring layer.
摘要翻译： 多层柔性布线基板包括第一和第二图案化布线层，介于第一布线层的表面和第二布线层的表面之间的树脂膜以及连接到第二布线层的表面的突起。 当凸块被迫进入树脂膜并且超声波被施加到凸块时，树脂膜适于形成开口。 凸块留在开口中以将凸块的顶部电连接到第一布线层。
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8.发明授权Processes for manufacturing flexible wiring boards and the resulting flexible wiring boards 失效用于制造柔性布线板和由此产生的柔性布线板的工艺公开(公告)号：US06729022B2
公开(公告)日：2004-05-04
申请号：US10230329
申请日：2002-08-29
申请人： Hideyuki Kurita , Masanao Watanabe
发明人： Hideyuki Kurita , Masanao Watanabe
IPC分类号： H05K310
CPC分类号： H05K3/4635 , H05K1/0393 , H05K3/005 , H05K3/28 , H05K3/423 , H05K3/4617 , H05K3/4647 , H05K3/4652 , H05K2201/0195 , H05K2201/0355 , H05K2201/09563 , H05K2203/0195 , H05K2203/0285 , H05K2203/1189 , Y10T29/49126 , Y10T29/49147 , Y10T29/49149 , Y10T29/49155
摘要： The present invention aims to connect metal films without forming any opening in a resin film. Against a first resin film 16 formed on a first metal film 12 are pressed bumps 21 on a second metal film 11 so that the bumps 21 are embedded into the first resin film 16. Either one of the first metal film 12 or the second metal film 11 or both is (are) patterned while the bumps 21 are in contact with the first metal film 12, and the first resin film 16 is heat-treated while the top of the first resin film is partially exposed to discharge the solvent or moisture from the exposed zone and cure the first resin film 16. After curing, the bumps 21 and the first metal film 12 may be ultrasonically bonded to each other. A second resin film and a third metal film may be further layered to form a multilayer structure.
摘要翻译： 本发明的目的是在不在树脂膜中形成任何开口的情况下连接金属膜。在第一金属膜12上形成的第一树脂膜16上，在第二金属膜11上形成按压凸块21，使得凸块21嵌入到第一金属膜11中。 在第一金属膜12或第二金属膜11中的任一个或两者均被图案化，同时凸块21与第一金属膜12接触，并且第一树脂膜16被热处理同时 第一树脂膜的顶部部分地暴露以从暴露区域排出溶剂或水分，并使第一树脂膜16固化。固化后，凸块21和第一金属膜12可以彼此超声波接合。 可以进一步层叠第二树脂膜和第三金属膜以形成多层结构。
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9.发明授权Board pieces, flexible wiring boards, and processes for manufacturing flexible wiring boards 有权板件，柔性布线板以及制造柔性布线板的工艺公开(公告)号：US06596947B1
公开(公告)日：2003-07-22
申请号：US09937590
申请日：2002-01-18
IPC分类号： H05K103
CPC分类号： H05K3/363 , H05K1/036 , H05K1/0393 , H05K3/28 , H05K3/284 , H05K3/305 , H05K3/3457 , H05K3/3473 , H05K3/3494 , H05K2201/0129 , H05K2201/10977 , H05K2203/0195 , H05K2203/0285 , H05K2203/065 , Y10T428/2804
摘要： A board piece 2 of the present invention comprises a non-thermoplastic resin film 11, a thermoplastic resin film 10 formed on the non-thermoplastic resin film 11 and a metal wiring 8 formed on the surface of the thermoplastic resin film 10. Metal wiring 8 is partially exposed on board piece 2 to form a contact 12. A low-melting metal coating 13 is formed on contact 12 and two board pieces 2a, 2b are pressed against each other under heating with contacts 12a, 12b thereof being in contact with each other so that thermoplastic resin films 10a, 10b soften to adhere board pieces 2a, 2b to each other and low-melting metal coatings 13a, 13b melt and then solidify to connect contacts 12a, 12b to each other. The region of metal wiring 8 not used for connection is wiring 17 connecting contacts 12 to each other and a cover film 19 can be provided on the surface thereof. Contacts 12a, 12b can also be connected by applying ultrasonic wave.
摘要翻译： 本发明的板片2包括非热塑性树脂膜11，形成在非热塑性树脂膜11上的热塑性树脂膜10和形成在热塑性树脂膜10的表面上的金属布线8.金属布线8 被部分地暴露在板件2上以形成触点12.在触点12上形成低熔点金属涂层13，并且两个板片2a，2b在加热时被彼此挤压，其触点12a，12b与每个 使得热塑性树脂膜10a，10b软化以将板片2a，2b彼此粘合并且熔融金属涂层13a，13b熔化然后固化以将触点12a，12b彼此连接。 不用于连接的金属布线8的区域是将触点12彼此连接的布线17，并且可以在其表面上设置覆盖膜19。 触点12a，12b也可以通过施加超声波来连接。
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公开(公告)号：US5621072A
公开(公告)日：1997-04-15
申请号：US418857
申请日：1995-04-07
申请人： Masanao Watanabe , Kohji Kuroda , Yoshiko Fujita
发明人： Masanao Watanabe , Kohji Kuroda , Yoshiko Fujita
IPC分类号： C12Q1/26 , C09F1/02 , C11B3/10 , C11B7/00 , C12Q1/28 , C12Q1/54 , C12Q1/58 , C12Q1/60 , G01N33/50 , G01N33/72 , C11D15/00 , G01N21/00
CPC分类号： C12Q1/58 , C09F1/02 , C12Q1/28 , C12Q1/54 , C12Q1/60 , G01N33/726 , C12Q2326/00
摘要： A purified guaiacum resin which is obtained by isolation from a natural guaiacum resin with chromatography using a gel for reversed chromatography as a stationary phase and a polar solvent as a mobile phase. The purified guaiacum resin does not contain substances causing the repellency of a specimen or constituents exhibiting unstable color development when it is used as a body fluid inspection agent and is subjected to color reaction in the presence of a peroxidase and hydrogen peroxide.
摘要翻译： 通过使用用于反相色谱的凝胶作为固定相和极性溶剂作为流动相的色谱法从天然愈伤子树脂中分离得到的纯化愈创木酚树脂。 纯化的愈伤组织树脂在用作体液检查剂时不含有试样或显色不稳定的成分的排斥性的物质，并且在过氧化物酶和过氧化氢的存在下进行着色反应。
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