Invention Grant
- Patent Title: Windowed package having embedded frame
- Patent Title (中): 具有嵌入式框架的窗口包装
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Application No.: US10777373Application Date: 2004-02-11
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Publication No.: US07026707B2Publication Date: 2006-04-11
- Inventor: Zong-Fu Li , Kabul Sengupta , Deborah L. Thompson
- Applicant: Zong-Fu Li , Kabul Sengupta , Deborah L. Thompson
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: H01L23/02
- IPC: H01L23/02
Abstract:
An integrated circuit (IC) package includes a mold compound, a die, and a window. The mold compound has a frame embedded within it. The frame has a top surface, a bottom surface, and a top-to-bottom opening therein. The die is attached to the mold compound, wherein the embedded frame lies below a periphery of the die. The window is attached to the mold compound and located above the die to allow light to reach the die.
Public/Granted literature
- US20040159902A1 Windowed package having embedded frame Public/Granted day:2004-08-19
Information query
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