发明授权
- 专利标题： Three-dimensional structure forming method
- 专利标题（中）： 三维结构成型方法
-
申请号： US10761293申请日： 2004-01-22
-
公开(公告)号： US07027227B2公开(公告)日： 2006-04-11
- 发明人: Keiko Chiba , Kenichiro Mori
- 申请人： Keiko Chiba , Kenichiro Mori
- 申请人地址： JP Tokyo
- 专利权人： Canon Kabushiki Kaisha
- 当前专利权人： Canon Kabushiki Kaisha
- 当前专利权人地址： JP Tokyo
- 代理机构： Fitzpatrick, Cella, Harper & Scinto
- 优先权： JP2003-014050 20030122
- 主分类号： G02B27/10
- IPC分类号： G02B27/10
摘要：
A method for forming a three-dimensional structure made of a photosensitive material on a substrate includes the steps of determining a film thickness of the photosensitive material necessary to form the desired three-dimensional structure, comparing a predetermined maximum film thickness with the film thickness determined by the determining step, and applying, when the film thickness determined by the determining step is greater than the predetermined maximum film thickness, the photosensitive material within the maximum film thickness plural times until the photosensitive material has the film thickness on the substrate.
公开/授权文献
- US20040152021A1 Three-dimensional structure forming method 公开/授权日：2004-08-05
信息查询
