Invention Grant
- Patent Title: High-frequency power amplifier
- Patent Title (中): 高频功率放大器
-
Application No.: US10819207Application Date: 2004-04-07
-
Publication No.: US07030698B2Publication Date: 2006-04-18
- Inventor: Seiki Goto , Yoshinobu Sasaki
- Applicant: Seiki Goto , Yoshinobu Sasaki
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Denki Kabushiki Kaisha
- Current Assignee: Mitsubishi Denki Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Leydig, Voit & Mayer, Ltd.
- Priority: JP2003-130178 20030508
- Main IPC: H03F3/68
- IPC: H03F3/68

Abstract:
In a high-frequency power amplifier, gate feed portions are formed by dividing a gate feed which connects transistor gate electrodes in parallel, and each of the gate feed portions includes a given number of gate electrodes connected in parallel. Each of transistor cell elements includes a set of the gate electrodes connected in parallel. A resistance wire is interposed between the transistor cell elements to isolate each transistor cell element. The resistance wire and the gate electrodes are made of the same metal material and formed by the same process. Thus, closed loop oscillation of transistors is suppressed with no increase in chip size.
Public/Granted literature
- US20040222854A1 High-frequency power amplifier Public/Granted day:2004-11-11
Information query