发明授权
- 专利标题: Method for packaging electronic modules and multiple chip packaging
- 专利标题(中): 电子模块和多芯片封装的封装方法
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申请号: US10492269申请日: 2002-09-26
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公开(公告)号: US07042085B2公开(公告)日: 2006-05-09
- 发明人: Kuno Wolf , Stephan Ernst , Robert Plikat , Wolfgang Feiler
- 申请人: Kuno Wolf , Stephan Ernst , Robert Plikat , Wolfgang Feiler
- 申请人地址: DE Stuttgart
- 专利权人: Robert Bosch GmbH
- 当前专利权人: Robert Bosch GmbH
- 当前专利权人地址: DE Stuttgart
- 代理机构: Kenyon & Kenyon
- 优先权: DE10149774 20011009
- 国际申请: PCT/DE02/03638 WO 20020926
- 国际公布: WO03/034495 WO 20030424
- 主分类号: H01L23/34
- IPC分类号: H01L23/34
摘要:
A method for packaging electronic assemblies and a multiple chip package, at least one power semiconductor chip being applied to a base plate using a first solder, at least one logic chip being applied to the base plate, the logic chip and the base plate being positioned electrically insulated from one another, at least one logic chip being connected to the at least one power semiconductor chip using signal transmission lines, and the electronic assembly including the at least one power semiconductor chip and the at least one logic chip being packaged using a molding compound in order to provide a multiple chip package.