Invention Grant
- Patent Title: Apparatus for conveying substrates
- Patent Title (中): 用于输送基材的设备
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Application No.: US10861006Application Date: 2004-06-04
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Publication No.: US07042553B2Publication Date: 2006-05-09
- Inventor: Geun-soo An , Gi-cheon Yoon
- Applicant: Geun-soo An , Gi-cheon Yoon
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Cantor Colburn LLP
- Priority: KR10-2003-0068367 20031001
- Main IPC: G03B27/58
- IPC: G03B27/58 ; G03D5/00 ; B65H1/00 ; B65G49/07

Abstract:
Disclosed herein is an apparatus for conveying substrates, which is capable of efficiently conveying large substrates and has a function to temporarily store the substrate in a buffer unit. The apparatus includes a substrate support unit, a conveying unit, and the buffer unit. The substrate support unit supports the substrate thereon. The conveying unit sequentially conveys the substrate support unit to a plurality of processing units. The buffer unit is provided at a predetermined portion of the conveying unit to move the substrate support unit upward away from the conveying unit in a vertical direction, thus temporarily storing the substrate support unit therein while spacing the substrate support unit apart from the conveying unit. The substrate conveying apparatus thus efficiently conveys the substrates, regardless of sizes of the substrates, while temporarily storing the substrates to buffer a difference in the processing time.
Public/Granted literature
- US20050073667A1 Apparatus for conveying substrates Public/Granted day:2005-04-07
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