发明授权
- 专利标题: High speed connector assembly
- 专利标题(中): 高速连接器总成
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申请号: US10744328申请日: 2003-12-23
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公开(公告)号: US07048585B2公开(公告)日: 2006-05-23
- 发明人: Donald W. Milbrand, Jr. , Thomas S. Cohen
- 申请人: Donald W. Milbrand, Jr. , Thomas S. Cohen
- 申请人地址: US MA Boston
- 专利权人: Teradyne, Inc.
- 当前专利权人: Teradyne, Inc.
- 当前专利权人地址: US MA Boston
- 代理机构: Teradyne Legal Department
- 主分类号: H01R13/648
- IPC分类号: H01R13/648
摘要:
There is disclosed a two-piece electrical connector assembly having a first electrical connector and a second electrical connector. The first electrical connector includes a plurality of first signal conductors disposed along first and second sides of a first insulative housing and first ground plates disposed along the first and second sides of the first insulative housing and positioned adjacent the plurality of first signal conductors. The first electrical connector defines a slot for receiving an edge of a first printed circuit board. The second electrical connector includes a plurality of second signal conductors disposed along first and second sides of a second insulative housing and second ground plates disposed along the first and second sides of the second insulative housing and positioned adjacent the plurality of second signal conductors. Each of the second ground plates has a surface with a first edge and a second edge, at least one of the first edge or the second edge being bent in the direction toward the corresponding second signal conductor. When the first electrical connector and the second electrical connector are mated, the first signal conductors and corresponding second signal conductors are substantially enclosed and shielded by the first and second ground plates.
公开/授权文献
- US20050136739A1 HIGH SPEED CONNECTOR ASSEMBLY 公开/授权日:2005-06-23
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