发明授权
US07050273B2 Bottom spin valve sensor having a lead overlay (LOL) structure fabricated thereon
失效
底部旋转阀传感器,其上制造有铅覆盖(LOL)结构
- 专利标题: Bottom spin valve sensor having a lead overlay (LOL) structure fabricated thereon
- 专利标题(中): 底部旋转阀传感器,其上制造有铅覆盖(LOL)结构
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申请号: US10922540申请日: 2004-08-20
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公开(公告)号: US07050273B2公开(公告)日: 2006-05-23
- 发明人: Cheng T. Horng , Mao-Min Chen , Chen-Jung Chien , Cherng-Chyi Han , Ru-Ying Tong , Chyu-Jiuh Torng , Hui-Chuan Wang
- 申请人: Cheng T. Horng , Mao-Min Chen , Chen-Jung Chien , Cherng-Chyi Han , Ru-Ying Tong , Chyu-Jiuh Torng , Hui-Chuan Wang
- 申请人地址: US CA Milpitas
- 专利权人: Headway Technologies, Inc.
- 当前专利权人: Headway Technologies, Inc.
- 当前专利权人地址: US CA Milpitas
- 代理商 George O. Saile; Stephen B. Ackerman
- 主分类号: G11B5/39
- IPC分类号: G11B5/39
摘要:
A method for fabricating a longitudinally hard biased, bottom spin valve GMR sensor with a lead overlay (LOL) conducting lead configuration and a narrow effective trackwidth. The advantageous properties of the sensor are obtained by providing two novel barrier layers, one of which prevents oxidation of and Au diffusion into the free layer during annealing and etching and the other of which prevents oxidation of the capping layer during annealing so as to allow good electrical contact between the lead and the sensor stack.
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