发明授权
- 专利标题: Thermal treatment equipment and thermal treatment method
- 专利标题(中): 热处理设备及热处理方法
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申请号: US10491432申请日: 2002-10-22
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公开(公告)号: US07050710B2公开(公告)日: 2006-05-23
- 发明人: Hiroshi Shinya , Yasutaka Souma , Takahiro Kitano
- 申请人: Hiroshi Shinya , Yasutaka Souma , Takahiro Kitano
- 申请人地址: JP Tokyo
- 专利权人: Tokyo Electron Limited
- 当前专利权人: Tokyo Electron Limited
- 当前专利权人地址: JP Tokyo
- 代理机构: Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
- 优先权: JP2001-327194 20011025
- 国际申请: PCT/JP02/10968 WO 20021022
- 国际公布: WO03/036694 WO 20030501
- 主分类号: F26B19/00
- IPC分类号: F26B19/00
摘要:
A heat treatment apparatus configured to perform heat treatment on a wafer having a surface on which a coating film is formed, and includes: a holding member for holding the wafer almost horizontally; a chamber for housing the wafer held by the holding member; a hot plate having gas permeability and disposed above the wafer held by the holding member in the chamber so that the coating film formed on the wafer can be directly heated; and an exhaust port provided on the top face of the chamber and exhausting gas in the chamber. Gas generated from the coating film passes through the hot plate and is exhausted from the chamber. Accordingly, uniformity of a coating film is improved. As a result, CD uniformity may be improved, LER characteristics may be improved, and a smooth pattern side face may be obtained.
公开/授权文献
- US20040245237A1 Thermal treatment equipment and thermal treatment method 公开/授权日:2004-12-09