- 专利标题： Semiconductor wafer with ID mark, equipment for and method of manufacturing semiconductor device from them
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申请号： US10101337申请日： 2002-03-20
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公开(公告)号： US07057259B2公开(公告)日： 2006-06-06
- 发明人: Tsunetoshi Arikado , Masao Iwase , Soichi Nadahara , Yuso Udo , Yukihiro Ushiku , Shinichi Nitta , Moriya Miyashita , Junji Sugamoto , Hiroaki Yamada , Hajime Nagano , Katsujiro Tanzawa , Hiroshi Matsushita , Norihiko Tsuchiya , Katsuya Okumura
- 申请人： Tsunetoshi Arikado , Masao Iwase , Soichi Nadahara , Yuso Udo , Yukihiro Ushiku , Shinichi Nitta , Moriya Miyashita , Junji Sugamoto , Hiroaki Yamada , Hajime Nagano , Katsujiro Tanzawa , Hiroshi Matsushita , Norihiko Tsuchiya , Katsuya Okumura
- 申请人地址： JP Tokyo
- 专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人地址： JP Tokyo
- 代理机构： Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- 优先权： JPP2001-080452 20010321; JPP2001-345984 20011112
- 主分类号： H01L29/06
- IPC分类号： H01L29/06
摘要：
A semiconductor wafer has a bevel contour formed along the periphery thereof, products formed on the wafer, and an ID mark formed on the bevel contour. The ID mark shows at least the properties, manufacturing conditions, and test results of the products.
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