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    Method of inspecting semiconductor wafer
    4.
    发明申请
    Method of inspecting semiconductor wafer 失效

    公开(公告)号：US20060281281A1

    公开(公告)日：2006-12-14

    申请号：US11444301

    申请日：2006-06-01

    申请人： Katsujiro Tanzawa ,  Norihiko Tsuchiya ,  Junji Sugamoto ,  Yukihiro Ushiku

    发明人： Katsujiro Tanzawa ,  Norihiko Tsuchiya ,  Junji Sugamoto ,  Yukihiro Ushiku

    IPC分类号： H01L21/66 ,  H01L21/30

    CPC分类号： H01L22/12 ,  G01N21/9501

    摘要： A method of inspecting a semiconductor wafer, comprises removing a device structure film on the semiconductor wafer with a chemical solution to expose a crystal surface of the semiconductor wafer; coating a protected area, which is a part of the crystal surface of the semiconductor wafer, with a mask material for protecting the crystal surface of the semiconductor wafer; etching the semiconductor wafer selectively, thereby making a crystal defect in a non-protected area, which is a part of the crystal surface of the semiconductor wafer that is not coated with the mask material, appear after the crystal surface is coated with the mask material; removing the mask material after the selective etching; carrying out quantitative measurement of the protected area and the non-protected area using an optical defect inspection apparatus or a beam-type defect inspection apparatus; and calculating the number of crystal defects of the semiconductor wafer base on the result of the measurement.

    Method of inspecting semiconductor wafer
    5.
    发明授权
    Method of inspecting semiconductor wafer 失效
    检查半导体晶圆的方法

    公开(公告)号：US07531462B2

    公开(公告)日：2009-05-12

    申请号：US11444301

    申请日：2006-06-01

    申请人： Katsujiro Tanzawa ,  Norihiko Tsuchiya ,  Junji Sugamoto ,  Yukihiro Ushiku

    发明人： Katsujiro Tanzawa ,  Norihiko Tsuchiya ,  Junji Sugamoto ,  Yukihiro Ushiku

    IPC分类号： H01L21/302

    CPC分类号： H01L22/12 ,  G01N21/9501

    摘要： A method of inspecting a semiconductor wafer, comprises removing a device structure film on the semiconductor wafer with a chemical solution to expose a crystal surface of the semiconductor wafer; coating a protected area, which is a part of the crystal surface of the semiconductor wafer, with a mask material for protecting the crystal surface of the semiconductor wafer; etching the semiconductor wafer selectively, thereby making a crystal defect in a non-protected area, which is a part of the crystal surface of the semiconductor wafer that is not coated with the mask material, appear after the crystal surface is coated with the mask material; removing the mask material after the selective etching; carrying out quantitative measurement of the protected area and the non-protected area using an optical defect inspection apparatus or a beam-type defect inspection apparatus; and calculating the number of crystal defects of the semiconductor wafer base on the result of the measurement.

    摘要翻译： 一种检查半导体晶片的方法，包括用化学溶液去除半导体晶片上的器件结构膜以暴露半导体晶片的晶体表面; 用保护半导体晶片的晶体表面的掩模材料涂覆作为半导体晶片的晶体表面的一部分的保护区域; 选择性地蚀刻半导体晶片，从而在未涂覆有掩模材料的半导体晶片的晶体表面的一部分的非保护区域中出现晶体缺陷，在晶体表面涂覆有掩模材料之后 ; 在选择性蚀刻之后去除掩模材料; 使用光学缺陷检查装置或光束型缺陷检查装置进行保护区域和非保护区域的定量测量; 并根据测量结果计算半导体晶片基底的晶体缺陷数。

    System and method for monitoring manufacturing apparatuses
    7.
    发明授权
    System and method for monitoring manufacturing apparatuses 失效
    用于监控制造装置的系统和方法

    公开(公告)号：US07221991B2

    公开(公告)日：2007-05-22

    申请号：US11068778

    申请日：2005-03-02

    申请人： Hiroshi Matsushita ,  Tomonobu Noda ,  Kenichi Kadota ,  Junji Sugamoto ,  Yukihiro Ushiku

    发明人： Hiroshi Matsushita ,  Tomonobu Noda ,  Kenichi Kadota ,  Junji Sugamoto ,  Yukihiro Ushiku

    IPC分类号： G06F19/00

    CPC分类号： H01L22/20 ,  G01R31/2894 ,  G05B23/0248 ,  G05B2219/31357 ,  Y02P90/14

    摘要： A control system for a manufacturing apparatus includes manufacturing information input unit acquiring time series data of apparatus parameters controlling manufacturing apparatuses; failure pattern classification module classifying in-plane distributions of failures of each of the wafers into failure patterns; an index calculation unit configured to statistically process the time series data by algorithms to calculate indices corresponding to the respective algorithms; an index analysis unit providing first and second frequency distributions of the indices categorized with and without the target failure pattern, to implement significance test between the first and second frequency distributions; and an abnormal parameter extraction unit extracting failure cause index of failure pattern by comparing value of the significance test with test reference value.

    摘要翻译： 一种制造装置的控制系统，包括制造信息输入单元，其获取控制制造装置的装置参数的时间序列数据; 故障模式分类模块将每个晶片的故障平面内分布分为故障模式; 索引计算单元，被配置为通过算法对所述时间序列数据进行统计处理，以计算与各个算法对应的索引; 索引分析单元，提供分类有和没有目标故障模式的索引的第一和第二频率分布，以实现第一和第二频率分布之间的显着性测试; 异常参数提取单元通过比较显着性检验值与检测参考值，提取失效原因指标的故障模式。

    System and method for controlling manufacturing apparatuses
    8.
    发明申请
    System and method for controlling manufacturing apparatuses 失效
    用于控制制造装置的系统和方法

    公开(公告)号：US20050194590A1

    公开(公告)日：2005-09-08

    申请号：US11068778

    申请日：2005-03-02

    申请人： Hiroshi Matsushita ,  Tomonobu Noda ,  Kenichi Kadota ,  Junji Sugamoto ,  Yukihiro Ushiku

    发明人： Hiroshi Matsushita ,  Tomonobu Noda ,  Kenichi Kadota ,  Junji Sugamoto ,  Yukihiro Ushiku

    IPC分类号： H01L21/66 ,  G01R31/26 ,  H01L21/02 ,  H01L23/58

    CPC分类号： H01L22/20 ,  G01R31/2894 ,  G05B23/0248 ,  G05B2219/31357 ,  Y02P90/14

    摘要： A control system for a manufacturing apparatus includes manufacturing information input unit acquiring time series data of apparatus parameters controlling manufacturing apparatuses; failure pattern classification module classifying in-plane distributions of failures of each of the wafers into failure patterns; an index calculation unit configured to statistically process the time series data by algorithms to calculate indices corresponding to the respective algorithms; an index analysis unit providing first and second frequency distributions of the indices categorized with and without the target failure pattern, to implement significance test between the first and second frequency distributions; and an abnormal parameter extraction unit extracting failure cause index of failure pattern by comparing value of the significance test with test reference value.

    摘要翻译： 一种制造装置的控制系统，包括制造信息输入单元，其获取控制制造装置的装置参数的时间序列数据; 故障模式分类模块将每个晶片的故障平面内分布分为故障模式; 索引计算单元，被配置为通过算法对所述时间序列数据进行统计处理，以计算与各个算法对应的索引; 索引分析单元，提供分类有和没有目标故障模式的索引的第一和第二频率分布，以实现第一和第二频率分布之间的显着性测试; 异常参数提取单元通过比较显着性检验值与检测参考值，提取失效原因指标的故障模式。

    Process control system, process control method, and method of manufacturing electronic apparatus
    10.
    发明授权
    Process control system, process control method, and method of manufacturing electronic apparatus 有权
    过程控制系统，过程控制方法和制造电子设备的方法

    公开(公告)号：US07596421B2

    公开(公告)日：2009-09-29

    申请号：US11471675

    申请日：2006-06-21

    申请人： Junji Sugamoto ,  Yukihiro Ushiku ,  Kazutaka Akiyama ,  Shoichi Harakawa

    发明人： Junji Sugamoto ,  Yukihiro Ushiku ,  Kazutaka Akiyama ,  Shoichi Harakawa

    IPC分类号： G06F19/00

    CPC分类号： G05B19/41875 ,  G05B2219/31477 ,  G05B2219/32057 ,  G05B2219/32097 ,  G05B2219/45031 ,  Y02P90/12 ,  Y02P90/20 ,  Y02P90/22

    摘要： A process control system includes a client computer which prepares a correlation between a reference monitored value of apparatus information and a feature quantity, a manufacturing execution system which prepares a processing recipe describing, as a first setting value in an actual manufacturing process, a value of the control parameter, an apparatus information collection section which collects an objective monitored value of the apparatus information in operation of the actual manufacturing process with the first setting value, a feature quantity calculation section which calculates a value of a feature quantity corresponding to the objective monitored value based on the correlation, a parameter calculation section which calculates a second setting value in the actual manufacturing process on the basis of the value of the feature quantity, and an apparatus control unit which changes the processing recipe with the second setting value being as a setting value of the second step.

    摘要翻译： 过程控制系统包括：准备设备信息的参考监视值和特征量之间的相关性的客户端计算机;准备描述作为实际制造过程中的第一设定值的处理配方的制造执行系统， 所述控制参数，设备信息收集部分，其在具有所述第一设定值的实际制造过程的操作中收集所述设备信息的客观监视值;特征量计算部，其计算与所监视的目标对应的特征量的值 基于相关性的值，参数计算部，其基于特征量的值计算实际制造过程中的第二设定值;以及装置控制单元，其将处理配方改变为第二设定值为 设定第二步的值。