利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

24 条记录 (耗时 0.017 秒)

    Process control system, process control method, and method of manufacturing electronic apparatus
    3.
    发明授权
    Process control system, process control method, and method of manufacturing electronic apparatus 有权
    过程控制系统，过程控制方法和制造电子设备的方法

    公开(公告)号：US07596421B2

    公开(公告)日：2009-09-29

    申请号：US11471675

    申请日：2006-06-21

    申请人： Junji Sugamoto ,  Yukihiro Ushiku ,  Kazutaka Akiyama ,  Shoichi Harakawa

    发明人： Junji Sugamoto ,  Yukihiro Ushiku ,  Kazutaka Akiyama ,  Shoichi Harakawa

    IPC分类号： G06F19/00

    CPC分类号： G05B19/41875 ,  G05B2219/31477 ,  G05B2219/32057 ,  G05B2219/32097 ,  G05B2219/45031 ,  Y02P90/12 ,  Y02P90/20 ,  Y02P90/22

    摘要： A process control system includes a client computer which prepares a correlation between a reference monitored value of apparatus information and a feature quantity, a manufacturing execution system which prepares a processing recipe describing, as a first setting value in an actual manufacturing process, a value of the control parameter, an apparatus information collection section which collects an objective monitored value of the apparatus information in operation of the actual manufacturing process with the first setting value, a feature quantity calculation section which calculates a value of a feature quantity corresponding to the objective monitored value based on the correlation, a parameter calculation section which calculates a second setting value in the actual manufacturing process on the basis of the value of the feature quantity, and an apparatus control unit which changes the processing recipe with the second setting value being as a setting value of the second step.

    摘要翻译： 过程控制系统包括：准备设备信息的参考监视值和特征量之间的相关性的客户端计算机;准备描述作为实际制造过程中的第一设定值的处理配方的制造执行系统， 所述控制参数，设备信息收集部分，其在具有所述第一设定值的实际制造过程的操作中收集所述设备信息的客观监视值;特征量计算部，其计算与所监视的目标对应的特征量的值 基于相关性的值，参数计算部，其基于特征量的值计算实际制造过程中的第二设定值;以及装置控制单元，其将处理配方改变为第二设定值为 设定第二步的值。

    Defect detection system, defect detection method, and defect detection program
    4.
    发明申请
    Defect detection system, defect detection method, and defect detection program 失效
    缺陷检测系统，缺陷检测方法和缺陷检测程序

    公开(公告)号：US20080004823A1

    公开(公告)日：2008-01-03

    申请号：US11812398

    申请日：2007-06-19

    申请人： Hiroshi Matsushita ,  Yasutaka Arakawa ,  Junji Sugamoto

    发明人： Hiroshi Matsushita ,  Yasutaka Arakawa ,  Junji Sugamoto

    IPC分类号： G06F19/00

    CPC分类号： G05B19/41875 ,  G01N21/9501 ,  G05B2219/32221 ,  G05B2219/32222 ,  Y02P90/04 ,  Y02P90/22

    摘要： A defect detection system includes a data acquiring section that acquires time series data of device parameter of each manufacturing device including an exposure device, and information on defect distribution in an area with a size smaller than a chip area size, a pattern classifying section that assembles the information on the defect distribution in units of shot or chip areas, and classifies the distributions to a defect pattern, a feature quantity calculating section that processes the time series data and calculates a feature quantity, a significant difference test section that calculates occurrence frequency distributions of the shot or chip area wherein the defect pattern to the feature quantity exists and does not exist, respectively, and determines the presence/absence of significant difference between the frequency distributions, and a defect detecting section that detects the device parameter corresponding to the feature quantity as the cause of defect of the defect pattern.

    摘要翻译： 缺陷检测系统包括数据获取部分，其获取包括曝光装置的每个制造装置的装置参数的时间序列数据以及尺寸小于芯片面积尺寸的区域中的缺陷分布的信息;模式分类部， 关于以镜头或码片区域为单位的缺陷分布的信息，并将分布分类为缺陷图案，处理时间序列数据并计算特征量的特征量计算部分，计算出现频率分布的显着差异测试部分 分别存在特征量的缺陷图案并且不存在的拍摄或切片区域，并且确定频率分布之间存在/不存在显着差异;以及缺陷检测部分，其检测与特征对应的设备参数 数量作为缺陷模式缺陷的原因。

    Process control system, process control method, and method of manufacturing electronic apparatus
    5.
    发明授权
    Process control system, process control method, and method of manufacturing electronic apparatus 有权
    过程控制系统，过程控制方法和制造电子设备的方法

    公开(公告)号：US07831330B2

    公开(公告)日：2010-11-09

    申请号：US12458421

    申请日：2009-07-10

    申请人： Junji Sugamoto ,  Yukihiro Ushiku ,  Kazutaka Akiyama ,  Shoichi Harakawa

    发明人： Junji Sugamoto ,  Yukihiro Ushiku ,  Kazutaka Akiyama ,  Shoichi Harakawa

    IPC分类号： G06F19/00

    CPC分类号： G05B19/41875 ,  G05B2219/31477 ,  G05B2219/32057 ,  G05B2219/32097 ,  G05B2219/45031 ,  Y02P90/12 ,  Y02P90/20 ,  Y02P90/22

    摘要： A process control system includes a client computer which prepares a correlation between a reference monitored value of apparatus information and a feature quantity, a manufacturing execution system which prepares a processing recipe describing, as a first setting value in an actual manufacturing process, a value of the control parameter, an apparatus information collection section which collects an objective monitored value of the apparatus information in operation of the actual manufacturing process with the first setting value, a feature quantity calculation section which calculates a value of a feature quantity corresponding to the objective monitored value based on the correlation, a parameter calculation section which calculates a second setting value in the actual manufacturing process on the basis of the value of the feature quantity, and an apparatus control unit which changes the processing recipe with the second setting value being as a setting value of the second step.

    摘要翻译： 过程控制系统包括：准备设备信息的参考监视值和特征量之间的相关性的客户端计算机;准备描述作为实际制造过程中的第一设定值的处理配方的制造执行系统， 所述控制参数，设备信息收集部分，其在具有所述第一设定值的实际制造过程的操作中收集所述设备信息的客观监视值;特征量计算部，其计算与所监视的目标对应的特征量的值 基于相关性的值，参数计算部，其基于特征量的值计算实际制造过程中的第二设定值;以及装置控制单元，其将处理配方改变为第二设定值为 设定第二步的值。

    Defect detection system, defect detection method, and defect detection program
    6.
    发明授权
    Defect detection system, defect detection method, and defect detection program 失效
    缺陷检测系统，缺陷检测方法和缺陷检测程序

    公开(公告)号：US07529631B2

    公开(公告)日：2009-05-05

    申请号：US11812398

    申请日：2007-06-19

    申请人： Hiroshi Matsushita ,  Yasutaka Arakawa ,  Junji Sugamoto

    发明人： Hiroshi Matsushita ,  Yasutaka Arakawa ,  Junji Sugamoto

    IPC分类号： G01B5/30

    CPC分类号： G05B19/41875 ,  G01N21/9501 ,  G05B2219/32221 ,  G05B2219/32222 ,  Y02P90/04 ,  Y02P90/22

    摘要： A defect detection system includes a data acquiring section that acquires time series data of device parameter of each manufacturing device including an exposure device, and information on defect distribution in an area with a size smaller than a chip area size, a pattern classifying section that assembles the information on the defect distribution in units of shot or chip areas, and classifies the distributions to a defect pattern, a feature quantity calculating section that processes the time series data and calculates a feature quantity, a significant difference test section that calculates occurrence frequency distributions of the shot or chip area wherein the defect pattern to the feature quantity exists and does not exist, respectively, and determines the presence/absence of significant difference between the frequency distributions, and a defect detecting section that detects the device parameter corresponding to the feature quantity as the cause of defect of the defect pattern.

    摘要翻译： 缺陷检测系统包括数据获取部分，其获取包括曝光装置的每个制造装置的装置参数的时间序列数据以及尺寸小于芯片面积尺寸的区域中的缺陷分布的信息;模式分类部， 关于以镜头或码片区域为单位的缺陷分布的信息，并将分布分类为缺陷图案，处理时间序列数据并计算特征量的特征量计算部分，计算出现频率分布的显着差异测试部分 分别存在特征量的缺陷图案并且不存在的拍摄或切片区域，并且确定频率分布之间存在/不存在显着差异;以及缺陷检测部分，其检测与特征对应的设备参数 数量作为缺陷模式缺陷的原因。

    Method and system for manufacturing a semiconductor device
    7.
    发明申请
    Method and system for manufacturing a semiconductor device 审中-公开
    用于制造半导体器件的方法和系统

    公开(公告)号：US20070254482A1

    公开(公告)日：2007-11-01

    申请号：US11790388

    申请日：2007-04-25

    申请人： Kenji Kawabata ,  Junji Sugamoto

    发明人： Kenji Kawabata ,  Junji Sugamoto

    IPC分类号： H01L21/66 ,  H01L23/58 ,  H01L21/44

    CPC分类号： H01L22/20

    摘要： A method for manufacturing a semiconductor device has measuring a finished state of a wafer in a completed process, estimating an in-surface tendency of the wafer based on a result of the measuring, estimating a surface characteristic of the wafer based on the estimated in-surface tendency, setting a process condition of a uncompleted process based on the estimated surface characteristic and controlling the uncompleted process based on the set process condition.

    摘要翻译： 一种制造半导体器件的方法，在完成的工艺中测量晶片的完成状态，基于测量结果估计晶片的表面内趋势，基于估计的晶体管内估计晶片的表面特性， 表面趋势，基于估计的表面特性设定未完成处理的处理条件，并基于设定的处理条件来控制未完成的处理。

    System and method for monitoring manufacturing apparatuses
    8.
    发明授权
    System and method for monitoring manufacturing apparatuses 失效
    用于监控制造装置的系统和方法

    公开(公告)号：US07221991B2

    公开(公告)日：2007-05-22

    申请号：US11068778

    申请日：2005-03-02

    申请人： Hiroshi Matsushita ,  Tomonobu Noda ,  Kenichi Kadota ,  Junji Sugamoto ,  Yukihiro Ushiku

    发明人： Hiroshi Matsushita ,  Tomonobu Noda ,  Kenichi Kadota ,  Junji Sugamoto ,  Yukihiro Ushiku

    IPC分类号： G06F19/00

    CPC分类号： H01L22/20 ,  G01R31/2894 ,  G05B23/0248 ,  G05B2219/31357 ,  Y02P90/14

    摘要： A control system for a manufacturing apparatus includes manufacturing information input unit acquiring time series data of apparatus parameters controlling manufacturing apparatuses; failure pattern classification module classifying in-plane distributions of failures of each of the wafers into failure patterns; an index calculation unit configured to statistically process the time series data by algorithms to calculate indices corresponding to the respective algorithms; an index analysis unit providing first and second frequency distributions of the indices categorized with and without the target failure pattern, to implement significance test between the first and second frequency distributions; and an abnormal parameter extraction unit extracting failure cause index of failure pattern by comparing value of the significance test with test reference value.

    摘要翻译： 一种制造装置的控制系统，包括制造信息输入单元，其获取控制制造装置的装置参数的时间序列数据; 故障模式分类模块将每个晶片的故障平面内分布分为故障模式; 索引计算单元，被配置为通过算法对所述时间序列数据进行统计处理，以计算与各个算法对应的索引; 索引分析单元，提供分类有和没有目标故障模式的索引的第一和第二频率分布，以实现第一和第二频率分布之间的显着性测试; 异常参数提取单元通过比较显着性检验值与检测参考值，提取失效原因指标的故障模式。