发明授权
- 专利标题： Semiconductor package with heat sink
- 专利标题（中）： 半导体封装带散热片
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申请号： US10690921申请日： 2003-10-21
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公开(公告)号： US07057276B2公开(公告)日： 2006-06-06
- 发明人: Chang-Fu Lin , Han-Ping Pu , Chien-Ping Huang
- 申请人： Chang-Fu Lin , Han-Ping Pu , Chien-Ping Huang
- 申请人地址： TW
- 专利权人： Siliconware Precision Industries Co., Ltd.
- 当前专利权人： Siliconware Precision Industries Co., Ltd.
- 当前专利权人地址： TW
- 代理机构： Edwards Angell Palmer & Dodge, LLP
- 代理商 Peter F. Corless; Steven M. Jensen
- 优先权： TW92115797A 20030611
- 主分类号： H01L23/10
- IPC分类号： H01L23/10 ; H01L23/34
摘要：
A semiconductor package with a heat sink is provided. At least one chip and a heat sink attached to the chip are mounted on a substrate. At least one slot is formed through at least one corner of the heat sink at a position attached to the substrate. An adhesive material is applied between the heat sink and substrate and over filled in the slot with an overflow of the adhesive material out of the slot. The adhesive material over filled in the slot provides an anchoring effect and increases its contact area with the heat sink to thereby firmly secure the heat sink on the substrate. Further, the slot formed at the corner of the heat sink can alleviate thermal stresses accumulated at the corner of the heat sink and thereby prevent delamination between the heat sink and the substrate.
公开/授权文献
- US20040251538A1 Semiconductor package with heat sink 公开/授权日：2004-12-16
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