发明授权
US07058248B2 Optical communication system with multiple photonic integrated circuit (PIC) chips and an external booster optical amplifier for photonic integrated circuits (PICs)
有权
具有多光子集成电路(PIC)芯片的光通信系统和用于光子集成电路(PIC)的外部增强型光放大器
- 专利标题: Optical communication system with multiple photonic integrated circuit (PIC) chips and an external booster optical amplifier for photonic integrated circuits (PICs)
- 专利标题(中): 具有多光子集成电路(PIC)芯片的光通信系统和用于光子集成电路(PIC)的外部增强型光放大器
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申请号: US10887630申请日: 2004-07-09
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公开(公告)号: US07058248B2公开(公告)日: 2006-06-06
- 发明人: Stephen G. Grubb , Matthew L. Mitchell , Robert B. Taylor , Ting-Kuang Chiang , Vincent G. Dominic
- 申请人: Stephen G. Grubb , Matthew L. Mitchell , Robert B. Taylor , Ting-Kuang Chiang , Vincent G. Dominic
- 申请人地址: US CA Sunnyvale
- 专利权人: Infinera Corporation
- 当前专利权人: Infinera Corporation
- 当前专利权人地址: US CA Sunnyvale
- 代理商 W. Douglas Carothers, Jr.
- 主分类号: G02B6/12
- IPC分类号: G02B6/12
摘要:
A C- and/or L-band booster optical amplifier is utilized in an optical communication system at the output of one or more semiconductor transmitter photonic integrated circuit (TxPIC) chips or the optical combined outputs of multiple semiconductor transmitter photonic integrated circuit (TxPIC) chips employed in an optical communication module, the deployment of integrated semiconductor optical amplifiers (SOAs) on the TxPIC chips can be eliminated. This would reduce both the complexity in designing and fabricating these chips as well as reducing the power consumption of the TxPIC chips. The deployment of such a Tx booster optical amplifier would also take into consideration the nonlinear effects of difficult high loss single mode fiber (SMF) or other fiber type links by allowing a higher power per channel to be achieved compared to the case where channel amplification is attempted solely on the TxPIC chip.