Invention Grant
US07059043B2 Method for mounting an electronic part by solder position detection
有权
通过焊接位置检测安装电子部件的方法
- Patent Title: Method for mounting an electronic part by solder position detection
- Patent Title (中): 通过焊接位置检测安装电子部件的方法
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Application No.: US10998470Application Date: 2004-11-29
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Publication No.: US07059043B2Publication Date: 2006-06-13
- Inventor: Wataru Hidese , Toshiaki Nakashima , Hiroshi Haji
- Applicant: Wataru Hidese , Toshiaki Nakashima , Hiroshi Haji
- Applicant Address: JP Osaka
- Assignee: Matsushita Electric Industrial Co., Ltd.
- Current Assignee: Matsushita Electric Industrial Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: Pearne & Gordon LLP
- Priority: JP2001-240820 20010808; JP2001-240821 20010808
- Main IPC: H05K3/30
- IPC: H05K3/30

Abstract:
An electronic parts mount apparatus for taking out electronic parts from a parts supply section 3by a transfer head 9 and transporting and mounting the electronic parts to and on a board 2 has a board recognition camera 15 moving independently of the transfer head 9 and advancing to and retreating from the board 2 positioned on a transfer passage 1 for picking up an image of the board 2 to detect the position thereof. The image pickup step of the board 2 by the board recognition camera 15 and the parts taking out step in the parts supply section by the transfer head 9 are performed concurrently. Thus, the tact time can be shortened and the electronic parts can be mounted on the board efficiently.
Public/Granted literature
- US20050108873A1 Apparatus and method for mounting electronic parts Public/Granted day:2005-05-26
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