Invention Grant
US07059043B2 Method for mounting an electronic part by solder position detection 有权
通过焊接位置检测安装电子部件的方法

Method for mounting an electronic part by solder position detection
Abstract:
An electronic parts mount apparatus for taking out electronic parts from a parts supply section 3by a transfer head 9 and transporting and mounting the electronic parts to and on a board 2 has a board recognition camera 15 moving independently of the transfer head 9 and advancing to and retreating from the board 2 positioned on a transfer passage 1 for picking up an image of the board 2 to detect the position thereof. The image pickup step of the board 2 by the board recognition camera 15 and the parts taking out step in the parts supply section by the transfer head 9 are performed concurrently. Thus, the tact time can be shortened and the electronic parts can be mounted on the board efficiently.
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