公开(公告)号：US07059043B2

公开(公告)日：2006-06-13

申请号：US10998470

申请日：2004-11-29

申请人： Wataru Hidese ,  Toshiaki Nakashima ,  Hiroshi Haji

发明人： Wataru Hidese ,  Toshiaki Nakashima ,  Hiroshi Haji

IPC分类号： H05K3/30

CPC分类号： H01L21/67259 ,  H01L21/67144 ,  H01L21/681 ,  H05K13/0452 ,  Y10T29/49004 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/49144 ,  Y10T29/53039 ,  Y10T29/53091 ,  Y10T29/53178 ,  Y10T29/53187 ,  Y10T29/53191 ,  Y10T29/53204

摘要： An electronic parts mount apparatus for taking out electronic parts from a parts supply section 3by a transfer head 9 and transporting and mounting the electronic parts to and on a board 2 has a board recognition camera 15 moving independently of the transfer head 9 and advancing to and retreating from the board 2 positioned on a transfer passage 1 for picking up an image of the board 2 to detect the position thereof. The image pickup step of the board 2 by the board recognition camera 15 and the parts taking out step in the parts supply section by the transfer head 9 are performed concurrently. Thus, the tact time can be shortened and the electronic parts can be mounted on the board efficiently.

摘要翻译： 一种用于通过转印头9从零件供应部分3中取出电子部件并将电子部件运输和安装到板2上的电子部件安装装置具有独立于转印头9移动并前进到 并且从位于传送通道1上的板2退回以拾取板2的图像以检测其位置。 同时执行由板识别摄像机15进行的板2的图像拾取步骤以及由转印头9在零件供给部中取出步骤的部分。 因此，可以缩短生产节拍时间，并且可以有效地将电子部件安装在板上。

公开(公告)号：US06839960B2

公开(公告)日：2005-01-11

申请号：US10216126

申请日：2002-08-08

申请人： Wataru Hidese ,  Toshiaki Nakashima ,  Hiroshi Haji

发明人： Wataru Hidese ,  Toshiaki Nakashima ,  Hiroshi Haji

IPC分类号： H01L21/00 ,  H01L21/68 ,  H05K13/04 ,  H05K3/30

CPC分类号： H01L21/67259 ,  H01L21/67144 ,  H01L21/681 ,  H05K13/0452 ,  Y10T29/49004 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/49144 ,  Y10T29/53039 ,  Y10T29/53091 ,  Y10T29/53178 ,  Y10T29/53187 ,  Y10T29/53191 ,  Y10T29/53204

摘要： Method for taking out electronic parts from a parts supply section by a transfer head and transporting and mounting the electronic parts to and on a board positioned on a transfer passage. In an image pickup step, a board recognition camera moves independently of the transfer head and advances to and retreats from the board for picking up an image of the board to detect the position thereof in a position detecting step. The image pickup step of the board by the board recognition camera and the parts taking out step in the parts supply section by the transfer head are performed concurrently. Thus, the tact time can be shortened and the electronic parts can be mounted on the board efficiently.

摘要翻译： 通过转印头从零件供应部分取出电子零件的方法，并将电子零件运送并安装在位于输送通道上的板上。 在图像拾取步骤中，电路板识别摄像机独立于转印头移动，并从板上移动和退出以拾取板的图像，以在位置检测步骤中检测其位置。 通过板识别摄像机进行的板的图像拾取步骤以及通过转印头从部件供给部分中取出步骤的部件同时进行。 因此，可以缩短生产节拍时间，并且可以有效地将电子部件安装在板上。

公开(公告)号：US20050108873A1

公开(公告)日：2005-05-26

申请号：US10998470

申请日：2004-11-29

申请人： Wataru Hidese ,  Toshiaki Nakashima ,  Hiroshi Haji

发明人： Wataru Hidese ,  Toshiaki Nakashima ,  Hiroshi Haji

IPC分类号： H01L21/00 ,  H01L21/68 ,  H05K13/04 ,  H05K3/30

CPC分类号： H01L21/67259 ,  H01L21/67144 ,  H01L21/681 ,  H05K13/0452 ,  Y10T29/49004 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/49144 ,  Y10T29/53039 ,  Y10T29/53091 ,  Y10T29/53178 ,  Y10T29/53187 ,  Y10T29/53191 ,  Y10T29/53204

摘要： An electronic parts mount apparatus for taking out electronic parts from a parts supply section 3by a transfer head 9 and transporting and mounting the electronic parts to and on a board 2 has a board recognition camera 15 moving independently of the transfer head 9 and advancing to and retreating from the board 2 positioned on a transfer passage 1 for picking up an image of the board 2 to detect the position thereof. The image pickup step of the board 2 by the board recognition camera 15 and the parts taking out step in the parts supply section by the transfer head 9 are performed concurrently. Thus, the tact time can be shortened and the electronic parts can be mounted on the board efficiently.

摘要翻译： 一种用于通过转印头9从零件供应部分3中取出电子部件并将电子部件运输和安装到板2上的电子部件安装装置具有独立于转印头9移动并前进到 并且从位于传送通道1上的板2退回以拾取板2的图像以检测其位置。 同时执行由板识别摄像机15进行的板2的图像拾取步骤以及由转印头9在零件供给部中取出步骤的部分。 因此，可以缩短生产节拍时间，并且可以有效地将电子部件安装在板上。

公开(公告)号：US06792676B2

公开(公告)日：2004-09-21

申请号：US10212955

申请日：2002-08-06

申请人： Hiroshi Haji ,  Wataru Hidese

发明人： Hiroshi Haji ,  Wataru Hidese

IPC分类号： H05K330

CPC分类号： H01L21/67259 ,  H01L21/67144 ,  H01L21/681 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/53091 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53187 ,  Y10T29/53191 ,  Y10T29/53261 ,  Y10T29/53478

摘要： An electronic parts mount apparatus for taking out semiconductor chips from a semiconductor wafer held on a wafer hold section by a transfer head comprising a plurality of suction nozzles and transporting and mounting the semiconductor chips to and on a board has a parts recognition camera disposed in a manner that it can advance to and retreat from the wafer hold section for picking up an image of the semiconductor wafer. A parts mounting step for mounting a plurality of semiconductor chips on the board by the transfer head and an image picking up step for picking up a plurality of semiconductor chips to be next taken out by the parts recognition camera are performed concurrently. Thereby, the number of electronic parts per mount turn can be increased, the tact time can be shortened, and the electronic parts can be efficiently taken out and mounted on the board.

摘要翻译： 一种电子部件安装装置，用于通过包括多个吸嘴的传送头从保持在晶片保持部分上的半导体晶片取出半导体芯片，并将半导体芯片传送和安装到板上并具有一个部件识别摄像机 从晶片保持部分前进和退出以拾取半导体晶片的图像的方式。 同时执行用于通过传送头将多个半导体芯片安装在板上的部件安装步骤和用于拾取由部件识别相机取出的多个半导体芯片的图像拾取步骤。 由此，可以提高每个安装转弯的电子部件的数量，可以缩短节拍时间，并且可以有效地将电子部件取出并安装在电路板上。

公开(公告)号：US07243420B2

公开(公告)日：2007-07-17

申请号：US10838442

申请日：2004-05-04

申请人： Hiroshi Haji ,  Wataru Hidese

发明人： Hiroshi Haji ,  Wataru Hidese

IPC分类号： H05K3/30

CPC分类号： H01L21/67253 ,  H01L21/67144 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/53087 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53187 ,  Y10T29/53191 ,  Y10T29/53261

摘要： In an electronic component mounting method, a camera transporting mechanism transports a camera to a component supplying unit to take an image of a component. Thereafter the camera is evacuated from an upper area of the component. The image taken by the camera is processed by a recognition processing unit to acquire a position of the component. A mounting head transporting mechanism positions the mounting head to the component based upon the recognition processing unit, and the component is picked up by the mounting head. Another camera transporting mechanism transports another camera over a board to take an image of the board. Thereafter, the camera is evacuated from an upper area of the board. The image taken of the board is processed by another recognition processing unit to determine a mounting position. The mounting head then positions the component on the board based upon the determined mounting position.

摘要翻译： 在电子部件安装方法中，相机传送机构将照相机传送到部件供应单元以拍摄部件的图像。 此后，照相机从组件的上部区域排出。 由摄像机拍摄的图像由识别处理单元处理以获取该组件的位置。 安装头传送机构基于识别处理单元将安装头定位到部件上，并且部件被安装头拾起。 另一台摄像机传输机构将另一台摄像机传输到一块板上，以拍摄该板的图像。 此后，相机从板的上部区域排出。 通过另一识别处理单元处理由该板拍摄的图像以确定安装位置。 然后，安装头基于所确定的安装位置将组件定位在板上。

公开(公告)号：US07137195B2

公开(公告)日：2006-11-21

申请号：US10763495

申请日：2004-01-23

申请人： Hiroshi Haji ,  Wataru Hidese

发明人： Hiroshi Haji ,  Wataru Hidese

IPC分类号： H05K3/30

CPC分类号： H01L21/67259 ,  H01L21/67144 ,  H01L21/681 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/53091 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53187 ,  Y10T29/53191 ,  Y10T29/53261 ,  Y10T29/53478

摘要： Provided is an electronic parts mount apparatus for taking out semiconductor chips from a semiconductor wafer held on a wafer hold section by a transfer head comprising a plurality of suction nozzles and transporting and mounting the semiconductor chips to and on a board has a parts recognition camera disposed in a manner that it can advance to and retreat from the wafer hold section for picking up an image of the semiconductor wafer. Also provided is a method including a parts mounting step for mounting a plurality of semiconductor chips on the board by the transfer head and an image picking up step for picking up a plurality of semiconductor chips to be next taken out by the parts recognition camera which are performed concurrently.

摘要翻译： 提供一种电子部件安装装置，用于通过包括多个吸嘴的转印头从保持在晶片保持部分上的半导体晶片取出半导体芯片，并将半导体芯片传送和安装到板上并具有一个部件识别相机 以使其可以前进到用于拾取半导体晶片的图像的晶片保持部分退回。 还提供了一种方法，包括用于通过传送头将多个半导体芯片安装在板上的部件安装步骤和用于拾取要由部件识别相机取出的多个半导体芯片的图像拾取步骤 同时执行。

公开(公告)号：US06874225B2

公开(公告)日：2005-04-05

申请号：US10316348

申请日：2002-12-11

申请人： Hiroshi Haji ,  Wataru Hidese

发明人： Hiroshi Haji ,  Wataru Hidese

IPC分类号： H01L23/48 ,  H01L21/00 ,  B23P19/00

CPC分类号： H01L21/67253 ,  H01L21/67144 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/53087 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53187 ,  Y10T29/53191 ,  Y10T29/53261

摘要： In this electronic component mounting apparatus, a mounting head is movably arranged between the electronic component supplying unit and the board holding unit. A first camera for taking an image of the board in the board holding unit and detecting an electronic component mounting position, and a second camera for taking images of the chips of the electronic component supplying unit are arranged in such a manner that the first camera and the second camera can be entered/evacuated as against the electronic component supplying unit. Therefore, the electronic component supplying unit and the board holding unit are defined as a range to be transported, and the mounting head, the first camera, and the second camera are relatively traveled in conjunction to each other, a loss-time in both the electronic component supplying unit and the board holding unit can be avoided, and tact time can be shortened to improve a work-efficiency.

摘要翻译： 在该电子部件安装装置中，安装头可移动地布置在电子部件供应单元和板保持单元之间。 用于拍摄板保持单元中的板的图像并检测电子部件安装位置的第一相机和用于拍摄电子部件供应单元的芯片的图像的第二相机被布置成使得第一相机和 可以相对于电子元件供应单元进入/排出第二相机。 因此，将电子元件供给单元和基板保持单元定义为要输送的范围，并且安装头，第一相机和第二相机彼此相对行进，在两者中的损失时间 可以避免电子元件供给单元和板保持单元，并且能够缩短节拍时间，提高作业效率。

公开(公告)号：US20100071195A1

公开(公告)日：2010-03-25

申请号：US11813872

申请日：2006-01-20

申请人： Masahiro Kihara ,  Masafumi Inoue ,  Wataru Hidese

发明人： Masahiro Kihara ,  Masafumi Inoue ,  Wataru Hidese

IPC分类号： B23P19/00

CPC分类号： H05K13/0413 ,  H05K13/0069 ,  H05K13/082 ,  Y10T29/49004 ,  Y10T29/53174

摘要： To provide an electronic component mounting system and an electronic component mounting method which can prevent a mounting failure due to positional error in a height direction of a substrate and ensure mounting quality.The electronic component mounting system includes a plurality of electronic component mounting devices connected to one another and mounts an electronic component on a substrate to manufacture a mounting substrate. A print test device for testing the substrate after solder printing measures a height position of a height measurement point set on the upper surface of the substrate 4 by a height measuring machine 22 and outputs a measurement result as substrate height data. In a component placing step using an electronic component placing device, a control parameter for controlling a component placing operation of the placing head 32 is updated. Accordingly, it is possible to correct a variation of the height position of an individual substrate and to prevent a mounting failure due to positional error in the height direction of the substrate.

摘要翻译： 提供一种能够防止由于基板的高度方向上的位置误差引起的安装故障并确保安装质量的电子部件安装系统和电子部件安装方法。 电子部件安装系统包括彼此连接的多个电子部件安装装置，并将电子部件安装在基板上以制造安装基板。 用于在焊接印刷之后测试基板的印刷测试装置通过高度测量机22测量设置在基板4的上表面上的高度测量点的高度位置，并输出测量结果作为基板高度数据。 在使用电子部件放置装置的部件放置步骤中，更新用于控制放置头32的部件放置操作的控制参数。 因此，可以校正单个基板的高度位置的变化，并且可以防止由于基板的高度方向上的位置误差引起的安装故障。

公开(公告)号：US5208975A

公开(公告)日：1993-05-11

申请号：US918063

申请日：1992-07-24

申请人： Wataru Hidese

发明人： Wataru Hidese

IPC分类号： H05K13/00 ,  H05K13/04

CPC分类号： H05K13/0069 ,  H05K13/0413 ,  Y10T29/4913 ,  Y10T29/53061 ,  Y10T29/53178 ,  Y10T29/53191

摘要： An electronic parts mounting apparatus includes an index rotary member. The index rotary member is rotated. A plurality of mounted heads are provided on the index rotary member for sucking electronic components, and for mounting the electronic components on a printed circuit board. The mounting heads are vertically moved through a stoke relative to the printed circuit board. The stroke of movement of the mounting heads is adjusted. A vertically-movable table is provided on a horizontally-movable table. Clampers are supported on the vertically-movable table for holding the printed circuit board therebetween. The vertically-movable table is vertically moved to adjust a height of the printed circuit board held between the clampers.

摘要翻译： 一种电子部件安装装置，包括索引旋转部件。 转动旋转构件旋转。 多个安装的头部设置在分度旋转构件上用于吸入电子部件，并且用于将电子部件安装在印刷电路板上。 安装头相对于印刷电路板垂直移动通过​​一个脚蹬。 调节安装头的运动行程。 可水平移动的桌子上设置有可垂直移动的桌子。 夹持器支撑在可垂直移动的工作台上，用于将印刷电路板夹在其间。 垂直移动的桌子被垂直移动以调节夹持器之间的印刷电路板的高度。

公开(公告)号：US5184397A

公开(公告)日：1993-02-09

申请号：US738622

申请日：1991-07-31

申请人： Wataru Hidese

发明人： Wataru Hidese

IPC分类号： B23P21/00 ,  H05K13/00 ,  H05K13/04

CPC分类号： H05K13/0413 ,  Y10T29/53178 ,  Y10T29/53478

摘要： An electrical component placing apparatus having a rotary head is required to be further accelerated to place an electrical component. In order to accelerate the operation of the placing apparatus, the indexing speed of the rotary head must be accelerated. However, since the rotary head is heavy, its rotating inertial is large. Thus, when the indexing speed of the rotary head is accelerated, a vibration at the time of stopping indexing of the rotary head is increased as well. Therefore, mistakes of picking up the electrical component by the pick and place head and placing the electrical component on the substrate occur. This invention reduces the outer diameter of a rotor for indexing a pick and place head smaller than the diameter of a guide for guiding the indexing of a pick and place head, disposes a bracket for supporting the pick and place head along the wall surface of the rotor and reduces the rotating diameter of the pick and place head smaller than the diameter of the guide. With the arrangement described above, the rotary head is reduced in size to largely reduce its weight and to reduce the rotary inertia of the rotary head. Therefore, the rotary inertia of the rotary head is reduced, and the vibration of the pick and place head at the time of indexing is reduced. Consequently, the rotary head can be indexed at a high speed, thereby placing the electrical component on the substrate at a high speed.

摘要翻译： 需要进一步加速具有旋转磁头的电气部件放置装置以放置电气部件。 为了加速放置装置的操作，必须加速旋转头的分度速度。 然而，由于旋转头很重，其旋转惯性大。 因此，当旋转头的分度速度加快时，旋转头的分度停止时的振动也增加。 因此，发生通过拾取头放置电子元件并将电气元件放置在基板上的错误。 本发明减小了转子的外径，用于使拾取头和放置头小于用于引导拾取头的分度的引导件的直径的头部放置头部，配置用于支撑拾取头的支架，并沿着壁的表面放置头部 转子，并减小拾音器的旋转直径，并将头部小于导轨的直径。 通过上述结构，旋转头的尺寸减小到很大程度上减轻其重量并降低旋转头的旋转惯性。 因此，旋转头的旋转惯性降低，并且在分度时的拾放头的振动减小。 因此，旋转头可以高速转位，从而高速地将电气部件放置在基板上。