Invention Grant
- Patent Title: Method for forming macropores in a layer and products obtained thereof
- Patent Title (中): 层中形成大孔的方法及其获得的产物
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Application No.: US11045954Application Date: 2005-01-28
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Publication No.: US07060587B2Publication Date: 2006-06-13
- Inventor: Twan Bearda , Eddy Kunnen
- Applicant: Twan Bearda , Eddy Kunnen
- Applicant Address: BE Leuven
- Assignee: Interuniversitair Microelektronica Centrum (IMEC)
- Current Assignee: Interuniversitair Microelektronica Centrum (IMEC)
- Current Assignee Address: BE Leuven
- Agency: Knobbe Martens Olson & Bear LLP
- Main IPC: H01L21/76
- IPC: H01L21/76
Abstract:
A method for forming macropores in a substrate is disclosed. On a substrate a pattern of submicron features is formed. This pattern is covered with a layer, which is preferably selectively removable with respect to the substrate and the submicron features. This cover layer is removed until the submicron features are exposed. The submicron features are then etched selectively to the cover layer, thereby creating a pattern of submicron openings in this cover layer. The patterned cover layer is used as a hardmask to etch macropores in the substrate.
Public/Granted literature
- US20050189318A1 Method for forming macropores in a layer and products obtained thereof Public/Granted day:2005-09-01
Information query
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