发明授权
- 专利标题： Multilayer wiring substrate, and method of producing same
- 专利标题（中）： 多层布线基板及其制造方法
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申请号： US10454530申请日： 2003-06-05
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公开(公告)号： US07060604B2公开(公告)日： 2006-06-13
- 发明人: Keiichiro Kata , Hirokazu Honda , Kazuhiro Baba , Tadanori Shimoto , Katsumi Kikuchi , Rokuro Kambe , Satoshi Hirano , Shinya Miyamoto
- 申请人： Keiichiro Kata , Hirokazu Honda , Kazuhiro Baba , Tadanori Shimoto , Katsumi Kikuchi , Rokuro Kambe , Satoshi Hirano , Shinya Miyamoto
- 申请人地址： JP Aichi JP Kanagawa
- 专利权人： NGK Spark Plug Co., Ltd.,NEC Electronics Corporation
- 当前专利权人： NGK Spark Plug Co., Ltd.,NEC Electronics Corporation
- 当前专利权人地址： JP Aichi JP Kanagawa
- 代理机构： Sughrue Mion, PLLC
- 优先权： JP2002-270225 20020917
- 主分类号： H01L21/4763
- IPC分类号： H01L21/4763
摘要：
A method of producing a multilayer wiring substrate is disclosed. The multilayer wiring substrate is free from a core substrate and includes a build up layer which includes an insulator layer and a wiring layer. One of a first main surface and a second main surface of the build up layer is formed with a metal supporting frame body. The method includes the steps of: forming a first insulator layer on a first main surface of a metal supporting plate, where the first insulator layer is included in the insulator layer and becomes a first resist layer which is positioned on the first main surface's side of the build up layer, and forming a first metal pad layer in a given position on a first main surface of the first insulator layer, where the first metal pad layer is included in the wiring layer and becomes a metal pad layer.
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