公开(公告)号：US20060189125A1

公开(公告)日：2006-08-24

申请号：US11411020

申请日：2006-04-26

申请人： Keiichiro Kata ,  Hirokazu Honda ,  Kazuhiro Baba ,  Tadanori Shimoto ,  Katsumi Kikuchi ,  Rokuro Kambe ,  Satoshi Hirano ,  Shinya Miyamoto

发明人： Keiichiro Kata ,  Hirokazu Honda ,  Kazuhiro Baba ,  Tadanori Shimoto ,  Katsumi Kikuchi ,  Rokuro Kambe ,  Satoshi Hirano ,  Shinya Miyamoto

IPC分类号： H01L21/4763

CPC分类号： H01L21/6835 ,  H01L21/4857 ,  H01L2221/68345 ,  H01L2924/19041 ,  H05K3/0035 ,  H05K3/28 ,  H05K3/4682 ,  H05K2201/2018 ,  H05K2203/0152 ,  H05K2203/0376

摘要： A method of producing a multilayer wiring substrate is disclosed. The multilayer wiring substrate is free from a core substrate and includes a build up layer which includes an insulator layer and a wiring layer. One of a first main surface and a second main surface of the build up layer is formed with a metal supporting frame body. The method includes the steps of: forming a first insulator layer on a first main surface of a metal supporting plate, where the first insulator layer is included in the insulator layer and becomes a first resist layer which is positioned on the first main surface's side of the build up layer, and forming a first metal pad layer in a given position on a first main surface of the first insulator layer, where the first metal pad layer is included in the wiring layer and becomes a metal pad layer.

公开(公告)号：US07233066B2

公开(公告)日：2007-06-19

申请号：US11411020

申请日：2006-04-26

申请人： Keiichiro Kata ,  Hirokazu Honda ,  Kazuhiro Baba ,  Tadanori Shimoto ,  Katsumi Kikuchi ,  Rokuro Kambe ,  Satoshi Hirano ,  Shinya Miyamoto

发明人： Keiichiro Kata ,  Hirokazu Honda ,  Kazuhiro Baba ,  Tadanori Shimoto ,  Katsumi Kikuchi ,  Rokuro Kambe ,  Satoshi Hirano ,  Shinya Miyamoto

IPC分类号： H01L23/48

CPC分类号： H01L21/6835 ,  H01L21/4857 ,  H01L2221/68345 ,  H01L2924/19041 ,  H05K3/0035 ,  H05K3/28 ,  H05K3/4682 ,  H05K2201/2018 ,  H05K2203/0152 ,  H05K2203/0376

摘要： A method of producing a multilayer wiring substrate is disclosed. The multilayer wiring substrate is free from a core substrate and includes a build up layer which includes an insulator layer and a wiring layer. One of a first main surface and a second main surface of the build up layer is formed with a metal supporting frame body. The method includes the steps of: forming a first insulator layer on a first main surface of a metal supporting plate, where the first insulator layer is included in the insulator layer and becomes a first resist layer which is positioned on the first main surface's side of the build up layer, and forming a first metal pad layer in a given position on a first main surface of the first insulator layer, where the first metal pad layer is included in the wiring layer and becomes a metal pad layer.

摘要翻译： 公开了一种制造多层布线基板的方法。 多层布线基板不含芯基板，并且包括包含绝缘体层和布线层的堆积层。 构建层的第一主表面和第二主表面之一形成有金属支撑框体。 该方法包括以下步骤：在金属支撑板的第一主表面上形成第一绝缘体层，其中第一绝缘体层包含在绝缘体层中，并成为位于第一绝缘体层的第一主表面侧的第一抗蚀剂层 并且在第一绝缘体层的第一主表面上的给定位置形成第一金属焊盘层，其中第一金属焊盘层包括在布线层中并且变成金属焊盘层。

公开(公告)号：US07060604B2

公开(公告)日：2006-06-13

申请号：US10454530

申请日：2003-06-05

申请人： Keiichiro Kata ,  Hirokazu Honda ,  Kazuhiro Baba ,  Tadanori Shimoto ,  Katsumi Kikuchi ,  Rokuro Kambe ,  Satoshi Hirano ,  Shinya Miyamoto

发明人： Keiichiro Kata ,  Hirokazu Honda ,  Kazuhiro Baba ,  Tadanori Shimoto ,  Katsumi Kikuchi ,  Rokuro Kambe ,  Satoshi Hirano ,  Shinya Miyamoto

IPC分类号： H01L21/4763

CPC分类号： H01L21/6835 ,  H01L21/4857 ,  H01L2221/68345 ,  H01L2924/19041 ,  H05K3/0035 ,  H05K3/28 ,  H05K3/4682 ,  H05K2201/2018 ,  H05K2203/0152 ,  H05K2203/0376

摘要： A method of producing a multilayer wiring substrate is disclosed. The multilayer wiring substrate is free from a core substrate and includes a build up layer which includes an insulator layer and a wiring layer. One of a first main surface and a second main surface of the build up layer is formed with a metal supporting frame body. The method includes the steps of: forming a first insulator layer on a first main surface of a metal supporting plate, where the first insulator layer is included in the insulator layer and becomes a first resist layer which is positioned on the first main surface's side of the build up layer, and forming a first metal pad layer in a given position on a first main surface of the first insulator layer, where the first metal pad layer is included in the wiring layer and becomes a metal pad layer.

摘要翻译： 公开了一种制造多层布线基板的方法。 多层布线基板不含芯基板，并且包括包含绝缘体层和布线层的堆积层。 构建层的第一主表面和第二主表面之一形成有金属支撑框体。 该方法包括以下步骤：在金属支撑板的第一主表面上形成第一绝缘体层，其中第一绝缘体层包含在绝缘体层中，并成为位于第一绝缘体层的第一主表面侧的第一抗蚀剂层 并且在第一绝缘体层的第一主表面上的给定位置形成第一金属焊盘层，其中第一金属焊盘层包括在布线层中并且变成金属焊盘层。

公开(公告)号：US07816782B2

公开(公告)日：2010-10-19

申请号：US11174526

申请日：2005-07-06

申请人： Hideya Murai ,  Tadanori Shimoto ,  Takuo Funaya ,  Katsumi Kikuchi ,  Shintaro Yamamichi ,  Kazuhiro Baba ,  Hirokazu Honda ,  Keiichiro Kata ,  Kouji Matsui ,  Shinichi Miyazaki

发明人： Hideya Murai ,  Tadanori Shimoto ,  Takuo Funaya ,  Katsumi Kikuchi ,  Shintaro Yamamichi ,  Kazuhiro Baba ,  Hirokazu Honda ,  Keiichiro Kata ,  Kouji Matsui ,  Shinichi Miyazaki

IPC分类号： H01L23/14 ,  H01L23/12

CPC分类号： H01L21/4857 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/5383 ,  H01L24/45 ,  H01L24/48 ,  H01L25/0657 ,  H01L2221/68345 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/181 ,  H05K3/007 ,  H05K3/205 ,  H05K3/28 ,  H05K3/4614 ,  H05K3/4682 ,  H05K2201/0376 ,  H05K2203/0152 ,  H05K2203/061 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A wiring substrate for mounting semiconductors is provided with an insulation film, wires formed in the insulation film, and a plurality of electrode pads that electrically connect to the wires through vias. The electrode pads are provided to have their surfaces exposed to both of the front surface and the rear surface of the insulation film, and at least a part of the side surface of the electrode pads is buried in the insulation film. The insulation film is formed by forming electrode pads on the respective two metallic plates, thereafter, laminating an insulation layer and wires on the respective metallic plates to cover the electrode pad, and adhering the insulation layers to each other for integration, and thereafter, removing the metallic plates.

摘要翻译： 用于安装半导体的布线基板设置有绝缘膜，形成在绝缘膜中的布线以及通过通孔电连接到导线的多个电极垫。 电极焊盘被设置为使其表面暴露于绝缘膜的前表面和后表面，并且电极焊盘的侧表面的至少一部分被埋在绝缘膜中。 绝缘膜通过在相应的两个金属板上形成电极焊盘而形成，然后在相应的金属板上层叠绝缘层和电线以覆盖电极焊盘，并将绝缘层彼此粘合在一起，然后除去 金属板。

公开(公告)号：US20060012048A1

公开(公告)日：2006-01-19

申请号：US11174526

申请日：2005-07-06

申请人： Hideya Murai ,  Tadanori Shimoto ,  Takuo Funaya ,  Katsumi Kikuchi ,  Shintaro Yamamichi ,  Kazuhiro Baba ,  Hirokazu Honda ,  Keiichiro Kata ,  Kouji Matsui ,  Shinichi Miyazaki

发明人： Hideya Murai ,  Tadanori Shimoto ,  Takuo Funaya ,  Katsumi Kikuchi ,  Shintaro Yamamichi ,  Kazuhiro Baba ,  Hirokazu Honda ,  Keiichiro Kata ,  Kouji Matsui ,  Shinichi Miyazaki

IPC分类号： H01L23/48

CPC分类号： H01L21/4857 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/5383 ,  H01L24/45 ,  H01L24/48 ,  H01L25/0657 ,  H01L2221/68345 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/181 ,  H05K3/007 ,  H05K3/205 ,  H05K3/28 ,  H05K3/4614 ,  H05K3/4682 ,  H05K2201/0376 ,  H05K2203/0152 ,  H05K2203/061 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A wiring substrate for mounting semiconductors is provided with an insulation film, wires formed in the insulation film, and a plurality of electrode pads that electrically connect to the wires through vias. The electrode pads are provided to have their surfaces exposed to both of the front surface and the rear surface of the insulation film, and at least a part of the side surface of the electrode pads is buried in the insulation film. The insulation film is formed by forming electrode pads on the respective two metallic plates, thereafter, laminating an insulation layer and wires on the respective metallic plates to cover the electrode pad, and adhering the insulation layers to each other for integration, and thereafter, removing the metallic plates.

摘要翻译： 用于安装半导体的布线基板设置有绝缘膜，形成在绝缘膜中的布线以及通过通孔电连接到导线的多个电极垫。 电极焊盘被设置为使其表面暴露于绝缘膜的前表面和后表面，并且电极焊盘的侧表面的至少一部分被埋在绝缘膜中。 绝缘膜通过在相应的两个金属板上形成电极焊盘而形成，然后在相应的金属板上层叠绝缘层和电线以覆盖电极焊盘，并将绝缘层彼此粘合在一起，然后除去 金属板。

公开(公告)号：US07566834B2

公开(公告)日：2009-07-28

申请号：US12140041

申请日：2008-06-16

申请人： Tadanori Shimoto ,  Katsumi Kikuchi ,  Hideya Murai ,  Kazuhiro Baba ,  Hirokazu Honda ,  Keiichiro Kata

发明人： Tadanori Shimoto ,  Katsumi Kikuchi ,  Hideya Murai ,  Kazuhiro Baba ,  Hirokazu Honda ,  Keiichiro Kata

IPC分类号： H05K1/00

CPC分类号： H01L23/49816 ,  H01L21/4857 ,  H01L21/6835 ,  H01L23/145 ,  H01L23/49822 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L2221/68345 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K1/0366 ,  H05K3/205 ,  H05K3/423 ,  H05K2201/0376 ,  H05K2201/068 ,  H05K2203/0733 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A wiring board has a base insulating film. The base insulating film has a thickness of 20 to 100 μm and is made of a heat-resistant resin which has a glass-transition temperature of 150° C. or higher and which contains reinforcing fibers made of glass or aramid. The base insulating film has the following physical properties (1) to (6) when an elastic modulus at a temperature of T° C. is given as DT (GPa) and a breaking strength at a temperature of T° C. is given as HT (MPa). (1) A coefficient of thermal expansion in the direction of thickness thereof is 90 ppm/K or less. (2) D23≧5 (3) D150≧2.5 (4) (D−65/D150)≦3.0 (5) H23≧140 (6) (H−65/H150)≦2.3.

摘要翻译： 布线板具有基底绝缘膜。 基底绝缘膜的厚度为20〜100μm，由玻璃化转变温度为150℃以上的含有玻璃或芳族聚酰胺的增强纤维的耐热性树脂构成。 当T℃温度下的弹性模量为DT（GPa）时，基体绝缘膜具有以下物理性质（1）〜（6）），在温度T℃下的断裂强度为 HT（MPa）。 （1）其厚度方向的热膨胀系数为90ppm / K以下。 （2）D23> = 5（3）D150> = 2.5（4）（D-65 / D150）<= 3.0（5）H23> = 140（6）（H-65 / H150）<= 2.3。

公开(公告)号：US20050252682A1

公开(公告)日：2005-11-17

申请号：US11125158

申请日：2005-05-10

申请人： Tadanori Shimoto ,  Katsumi Kikuchi ,  Hideya Murai ,  Kazuhiro Baba ,  Hirokazu Honda ,  Keiichiro Kata

发明人： Tadanori Shimoto ,  Katsumi Kikuchi ,  Hideya Murai ,  Kazuhiro Baba ,  Hirokazu Honda ,  Keiichiro Kata

IPC分类号： H01L23/12 ,  H01L21/48 ,  H01L21/68 ,  H01L23/14 ,  H01L23/498 ,  H01L25/065 ,  H05K1/03 ,  H05K1/11 ,  H05K3/20 ,  H05K3/42

CPC分类号： H01L23/49816 ,  H01L21/4857 ,  H01L21/6835 ,  H01L23/145 ,  H01L23/49822 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L2221/68345 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K1/0366 ,  H05K3/205 ,  H05K3/423 ,  H05K2201/0376 ,  H05K2201/068 ,  H05K2203/0733 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A wiring board has a base insulating film. The base insulating film has a thickness of 20 to 100 μm and is made of a heat-resistant resin which has a glass-transition temperature of 150° C. or higher and which contains reinforcing fibers made of glass or aramid. The base insulating film has the following physical properties (1) to (6) when an elastic modulus at a temperature of T° C. is given as DT (GPa) and a breaking strength at a temperature of T° C. is given as HT (MPa). (1) A coefficient of thermal expansion in the direction of thickness thereof is 90 ppm/K or less. (2) D23≧5 (3) D150≧2.5 (4) (D-65/D150)≦3.0 (5) H23≧140 (6) (H-65/H150)≦2.3

摘要翻译： 布线板具有基底绝缘膜。 基底绝缘膜的厚度为20〜100μm，由玻璃化转变温度为150℃以上的含有玻璃或芳族聚酰胺的增强纤维的耐热性树脂构成。 当在T℃的温度下的弹性模量为D T（GPa）时，基体绝缘膜具有以下物理性质（1）至（6））和在温度下的断裂强度 的T℃给出为H T（MPa）。 （1）其厚度方向的热膨胀系数为90ppm / K以下。 （2）D 23 = 5（3）D 150 > = 2.5（4）（D-65 / D 150 <= 3.0（5）H 23 = 140（6）（H-65 / H 150） 2.3

公开(公告)号：US08198140B2

公开(公告)日：2012-06-12

申请号：US12882277

申请日：2010-09-15

申请人： Hideya Murai ,  Tadanori Shimoto ,  Takuo Funaya ,  Katsumi Kikuchi ,  Shintaro Yamamichi ,  Kazuhiro Baba ,  Hirokazu Honda ,  Keiichiro Kata ,  Kouji Matsui ,  Shinichi Miyazaki

发明人： Hideya Murai ,  Tadanori Shimoto ,  Takuo Funaya ,  Katsumi Kikuchi ,  Shintaro Yamamichi ,  Kazuhiro Baba ,  Hirokazu Honda ,  Keiichiro Kata ,  Kouji Matsui ,  Shinichi Miyazaki

IPC分类号： H01L21/44 ,  H01L21/48

CPC分类号： H01L21/4857 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/5383 ,  H01L24/45 ,  H01L24/48 ,  H01L25/0657 ,  H01L2221/68345 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/181 ,  H05K3/007 ,  H05K3/205 ,  H05K3/28 ,  H05K3/4614 ,  H05K3/4682 ,  H05K2201/0376 ,  H05K2203/0152 ,  H05K2203/061 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A wiring substrate for mounting semiconductors is provided with an insulation film, wires formed in the insulation film, and a plurality of electrode pads that electrically connect to the wires through vias. The electrode pads are provided to have their surfaces exposed to both of the front surface and the rear surface of the insulation film, and at least a part of the side surface of the electrode pads is buried in the insulation film. The insulation film is formed by forming electrode pads on the respective two metallic plates, thereafter, laminating an insulation layer and wires on the respective metallic plates to cover the electrode pad, and adhering the insulation layers to each other for integration, and thereafter, removing the metallic plates.

摘要翻译： 用于安装半导体的布线基板设置有绝缘膜，形成在绝缘膜中的布线以及通过通孔电连接到导线的多个电极垫。 电极焊盘被设置为使其表面暴露于绝缘膜的前表面和后表面，并且电极焊盘的侧表面的至少一部分被埋在绝缘膜中。 绝缘膜通过在相应的两个金属板上形成电极焊盘而形成，然后在相应的金属板上层叠绝缘层和电线以覆盖电极焊盘，并将绝缘层彼此粘合在一起，然后除去 金属板。

公开(公告)号：US07397000B2

公开(公告)日：2008-07-08

申请号：US11125158

申请日：2005-05-10

申请人： Tadanori Shimoto ,  Katsumi Kikuchi ,  Hideya Murai ,  Kazuhiro Baba ,  Hirokazu Honda ,  Keiichiro Kata

发明人： Tadanori Shimoto ,  Katsumi Kikuchi ,  Hideya Murai ,  Kazuhiro Baba ,  Hirokazu Honda ,  Keiichiro Kata

IPC分类号： H05K1/00

CPC分类号： H01L23/49816 ,  H01L21/4857 ,  H01L21/6835 ,  H01L23/145 ,  H01L23/49822 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L2221/68345 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K1/0366 ,  H05K3/205 ,  H05K3/423 ,  H05K2201/0376 ,  H05K2201/068 ,  H05K2203/0733 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A wiring board has a base insulating film. The base insulating film has a thickness of 20 to 100 μm and is made of a heat-resistant resin which has a glass-transition temperature of 150° C. or higher and which contains reinforcing fibers made of glass or aramid. The base insulating film has the following physical properties (1) to (6) when an elastic modulus at a temperature of T° C. is given as DT (GPa) and a breaking strength at a temperature of T° C. is given as HT (MPa). (1) A coefficient of thermal expansion in the direction of thickness thereof is 90 ppm/K or less (2) D23≧5 (3) D150≧2.5 (4) (D−65/D150)≦3.0 (5) H23≧140 (6) (H−65/H150)≦2.3.

摘要翻译： 布线板具有基底绝缘膜。 基底绝缘膜的厚度为20〜100μm，由玻璃化转变温度为150℃以上的含有玻璃或芳族聚酰胺的增强纤维的耐热性树脂构成。 当在T℃的温度下的弹性模量为D T（GPa）时，基体绝缘膜具有以下物理性质（1）至（6））和在温度下的断裂强度 的T℃给出为H T（MPa）。 （1）其厚度方向的热膨胀系数为90ppm / K以下（2）D 23 = 5（3）D 150 = 140（6）（H < => 150 150

公开(公告)号：US07294393B2

公开(公告)日：2007-11-13

申请号：US11167623

申请日：2005-06-27

申请人： Hideya Murai ,  Tadanori Shimoto ,  Kazuhiro Baba ,  Katsumi Kikuchi

发明人： Hideya Murai ,  Tadanori Shimoto ,  Kazuhiro Baba ,  Katsumi Kikuchi

IPC分类号： B32B3/06

CPC分类号： H05K3/4673 ,  B32B7/12 ,  H05K3/4644 ,  H05K2201/0154 ,  H05K2201/0195 ,  H05K2201/0358 ,  Y10T428/24917 ,  Y10T428/249953 ,  Y10T428/249955 ,  Y10T428/249958 ,  Y10T428/31681

摘要： In a sheet material (1), a bonding layer (2) is provided, and then a high-strength layer (3) is laminated on the bonding layer (2). The bonding layer (2) is made of an epoxy resin being a thermosetting material. The high-strength layer (3) is made of polyimide, which is not softened at a thermosetting temperature of the epoxy resin and has a tensile rupture strength higher than that of the cured thermosetting material. Moreover, the polyimide has a tensile rupture strength of 100 MPa or higher at 23° C. and a tensile rupture elongation of 10% or higher at 23° C. Assuming that a tensile rupture strength at −65° C. is a and a tensile rupture strength at 150° C. is b, a ratio (a/b) is 2.5 or less.

摘要翻译： 在片材（1）中，设置接合层（2），然后在接合层（2）上层叠高强度层（3）。 接合层（2）由作为热固性材料的环氧树脂制成。 高强度层（3）由聚酰亚胺制成，其在环氧树脂的热固化温度下不软化，并且其拉伸断裂强度高于固化的热固性材料的拉伸断裂强度。 此外，聚酰亚胺在23℃下的拉伸断裂强度为100MPa以上，在23℃下的拉伸断裂伸长率为10％以上。假设在-65℃下的拉伸断裂强度为a和a 150℃时的拉伸断裂强度为b，比率（a / b）为2.5以下。