发明授权
- 专利标题： Controlling cumulative wafer effects
- 专利标题（中）： 控制累积晶圆效应
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申请号： US10184814申请日： 2002-06-28
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公开(公告)号： US07069103B1公开(公告)日： 2006-06-27
- 发明人: Christopher A. Bode , Matthew A. Purdy
- 申请人： Christopher A. Bode , Matthew A. Purdy
- 专利权人： Advanced Micro Devices, Inc.
- 当前专利权人： Advanced Micro Devices, Inc.
- 代理机构： Williams Morgan & Amerson, P.C.
- 主分类号： G06F19/00
- IPC分类号： G06F19/00
摘要：
A method and apparatus provided for controlling cumulative wafer effects. The method comprises processing a workpiece, determining a cumulative effect of the processing on the workpiece and comparing the determined cumulative effect to a reference target value. The method further comprises adjusting a downstream process of the workpiece based on comparing the determined cumulative effect to the reference target value.
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