发明授权
- 专利标题： Water-cooling heat dissipation system
- 专利标题（中）： 水冷散热系统
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申请号： US10827277申请日： 2004-04-20
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公开(公告)号： US07069737B2公开(公告)日： 2006-07-04
- 发明人: Jack Wang , Cheng-Hua Cheng , Michael Lin , Charles Ma
- 申请人： Jack Wang , Cheng-Hua Cheng , Michael Lin , Charles Ma
- 申请人地址： TW Taoyuan TW Taoyuan
- 专利权人： Waffer Technology Corp.,Jack Wang
- 当前专利权人： Waffer Technology Corp.,Jack Wang
- 当前专利权人地址： TW Taoyuan TW Taoyuan
- 主分类号： F25D23/12
- IPC分类号： F25D23/12
摘要：
A water-cooling heat dissipation system includes a heat sink mounted on a heat generating electronic device and a circulating loop connected to two ends of the heat sink. The circulating loop has a water pump attached at the inlet of the heat sink, a first cooling base attached at the outlet of the heat sink, and a second cooling base between the water pump and the heat sink. The second cooling base has a cryogenic chip to provide icy water to the heat sink, such that heat dissipation efficiency is greatly enhanced.
公开/授权文献
- US20050230086A1 Water-cooling heat dissipation system 公开/授权日：2005-10-20
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