Invention Grant
- Patent Title: Water-cooling heat dissipation system
- Patent Title (中): 水冷散热系统
-
Application No.: US10827277Application Date: 2004-04-20
-
Publication No.: US07069737B2Publication Date: 2006-07-04
- Inventor: Jack Wang , Cheng-Hua Cheng , Michael Lin , Charles Ma
- Applicant: Jack Wang , Cheng-Hua Cheng , Michael Lin , Charles Ma
- Applicant Address: TW Taoyuan TW Taoyuan
- Assignee: Waffer Technology Corp.,Jack Wang
- Current Assignee: Waffer Technology Corp.,Jack Wang
- Current Assignee Address: TW Taoyuan TW Taoyuan
- Main IPC: F25D23/12
- IPC: F25D23/12
Abstract:
A water-cooling heat dissipation system includes a heat sink mounted on a heat generating electronic device and a circulating loop connected to two ends of the heat sink. The circulating loop has a water pump attached at the inlet of the heat sink, a first cooling base attached at the outlet of the heat sink, and a second cooling base between the water pump and the heat sink. The second cooling base has a cryogenic chip to provide icy water to the heat sink, such that heat dissipation efficiency is greatly enhanced.
Public/Granted literature
- US20050230086A1 Water-cooling heat dissipation system Public/Granted day:2005-10-20
Information query
IPC分类:
