- 专利标题: In-situ metalization monitoring using eddy current measurements during the process for removing the film
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申请号: US11115835申请日: 2005-04-26
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公开(公告)号: US07070476B2公开(公告)日: 2006-07-04
- 发明人: Kurt R. Lehman , Shing M. Lee , Walter Halmer Johnson, III , John Fielden
- 申请人: Kurt R. Lehman , Shing M. Lee , Walter Halmer Johnson, III , John Fielden
- 申请人地址: US CA San Jose
- 专利权人: KLA-Tencor Corporation
- 当前专利权人: KLA-Tencor Corporation
- 当前专利权人地址: US CA San Jose
- 代理机构: Beyer, Weaver & Thomas, LLP.
- 主分类号: B24B49/00
- IPC分类号: B24B49/00
摘要:
A method for measuring conductance of a sample using an eddy current probe with a sensing coil. The method includes N repetitions of measuring first and second voltage pairs including in-phase and quadrature components of an induced AC voltage in the sensing coil, calibrating the first signal based on the measured second signal at a different separation from the sample and reference material, determining a conductance function relating conductance with location along the selected curve, processing the calibrated first voltage pairs to generate a lift-off curve, determining an intersection voltage pair representing intersection of the lift-off curve with a selected curve, and determining the conductance of the sample from the intersection voltage pair and the conductance function.
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