In-situ metalization monitoring using eddy current measurements during the process for removing the film
    1.
    发明授权
    In-situ metalization monitoring using eddy current measurements during the process for removing the film 有权
    在去除薄膜的过程中使用涡流测量进行原位金属化监测

    公开(公告)号:US06433541B1

    公开(公告)日:2002-08-13

    申请号:US09633198

    申请日:2000-08-07

    IPC分类号: G01B706

    CPC分类号: G01N27/72

    摘要: Disclosed is a method of obtaining information in-situ regarding a film of a sample using an eddy probe during a process for removing the film. The eddy probe has at least one sensing coil. An AC voltage is applied to the sensing coil(s) of the eddy probe. One or more first signals are measured in the sensing coil(s) of the eddy probe when the sensing coil(s) are positioned proximate the film of the sample. One or more second signals are measured in the sensing coil(s) of the eddy probe when the sensing coil(s) are positioned proximate to a reference material having a fixed composition and/or distance from the sensing coil. The first signals are calibrated based on the second signals so that undesired gain and/or phase changes within the first signals are corrected. A property value of the film is determined based on the calibrated first signals. An apparatus for performing the above described method is also disclosed.

    摘要翻译: 公开了一种在除去膜的过程中使用涡流探针在原位获取样品的膜的方法。 涡流探头具有至少一个感测线圈。 交流电压被施加到涡流探头的感测线圈上。 当感测线圈靠近样品的膜定位时,在涡流探针的感测线圈中测量一个或多个第一信号。 当感测线圈靠近具有与感测线圈的固定成分和/或距离的参考材料定位时,在涡流探针的感测线圈中测量一个或多个第二信号。 第一信号基于第二信号进行校准,从而校正第一信号内的不期望的增益和/或相位变化。 基于校准的第一信号确定胶片的属性值。 还公开了一种用于执行上述方法的装置。

    In-situ metalization monitoring using eddy current and optical measurements
    2.
    发明授权
    In-situ metalization monitoring using eddy current and optical measurements 有权
    使用涡流和光学测量进行原位金属化监测

    公开(公告)号:US06707540B1

    公开(公告)日:2004-03-16

    申请号:US09633800

    申请日:2000-08-07

    IPC分类号: G01N2100

    CPC分类号: G01N27/72

    摘要: Disclosed is a chemical mechanical polishing (CMP) system for polishing a sample with a polishing agent and monitoring the sample. The CMP system includes a polishing table, a sample carrier arranged to hold the sample over the polishing table, and an eddy probe. The polishing table and sample carrier are arranged to receive a polishing agent between the sample and the polishing table and to polish the sample by moving the polishing table and the sample carrier relative to each other. The eddy probe is arranged to be operable to obtain a measurement of the sample while the sample is being polished. The CMP system further includes an optical measurement device arranged to be operable to obtain a measurement of the sample while the sample is being polished. The CMP system also has a memory and a processor coupled with the memory. The processor and memory are adapted for operating the eddy probe and optical measurement device.

    摘要翻译: 公开了一种用抛光剂抛光样品并监测样品的化学机械抛光(CMP)系统。 CMP系统包括抛光台,布置成将样品保持在抛光台上的样品载体和涡流探针。 抛光台和样品载体布置成在样品和抛光台之间接收抛光剂,并通过相对于彼此移动抛光台和样品载体来抛光样品。 涡流探针布置成可操作以在样品被抛光时获得样品的测量。 CMP系统还包括光学测量装置,其布置成可操作以在样品被抛光时获得样品的测量。 CMP系统还具有与存储器耦合的存储器和处理器。 处理器和存储器适于操作涡流探针和光学测量装置。

    In-situ metalization monitoring using eddy current measurements during the process for removing the film
    4.
    发明授权
    In-situ metalization monitoring using eddy current measurements during the process for removing the film 有权
    在去除薄膜的过程中使用涡流测量进行原位金属化监测

    公开(公告)号:US06885190B2

    公开(公告)日:2005-04-26

    申请号:US10623953

    申请日:2003-07-21

    IPC分类号: G01N27/72 G01R33/12

    CPC分类号: G01N27/72

    摘要: A method for measuring conductance of a sample using an eddy current probe with a sensing coil. The method includes N repetitions of measuring first and second voltage pairs including in-phase and quadrature components of an induced AC voltage in the sensing coil, calibrating the first signal based on the measured second signal at a different separation from the sample and reference material, determining a conductance function relating conductance with location along the selected curve, processing the calibrated first voltage pairs to generate a lift-off curve, determining an intersection voltage pair representing intersection of the lift-off curve with a selected curve, and determining the conductance of the sample from the intersection voltage pair and the conductance function.

    摘要翻译: 使用具有感测线圈的涡流探头测量样品的电导率的方法。 该方法包括测量包括感测线圈中的感应AC电压的同相和正交分量的第一和第二电压对的N次重复,基于在与样本和参考材料不同的分离处测量的第二信号来校准第一信号, 确定与所选择的曲线相关的电导与位置的电导函数,处理校准的第一电压对以产生剥离曲线,确定表示取出曲线与选定曲线的交点的交叉电压对,以及确定 来自交点电压对的样本和电导函数。

    In-situ metalization monitoring using eddy current measurements during the process for removing the film
    5.
    发明授权
    In-situ metalization monitoring using eddy current measurements during the process for removing the film 有权
    在去除薄膜的过程中使用涡流测量进行原位金属化监测

    公开(公告)号:US06621264B1

    公开(公告)日:2003-09-16

    申请号:US10166585

    申请日:2002-06-05

    IPC分类号: G01B706

    CPC分类号: G01N27/72

    摘要: A method for measuring conductance of a sample using an eddy current probe with a sensing coil. The method includes N repetitions of measuring first and second voltage pairs including in-phase and quadrature components of an induced AC voltage in the sensing coil, calibrating the first signal based on the measured second signal at a different separation from the sample and reference material, determining a conductance function relating conductance with location along the selected curve, processing the calibrated first voltage pairs to generate a lift-off curve, determining an intersection voltage pair representing intersection of the lift-off curve with a selected curve, and determining the conductance of the sample from the intersection voltage pair and the conductance function.

    摘要翻译: 使用具有感测线圈的涡流探头测量样品的电导率的方法。 该方法包括测量包括感测线圈中的感应AC电压的同相和正交分量的第一和第二电压对的N次重复,基于在与样本和参考材料不同的分离处测量的第二信号来校准第一信号, 确定与所选择的曲线相关的电导与位置的电导函数,处理校准的第一电压对以产生剥离曲线,确定表示取出曲线与选定曲线的交点的交叉电压对,以及确定 来自交点电压对的样本和电导函数。