In-situ metalization monitoring using eddy current measurements during the process for removing the film
    1.
    发明授权
    In-situ metalization monitoring using eddy current measurements during the process for removing the film 有权
    在去除薄膜的过程中使用涡流测量进行原位金属化监测

    公开(公告)号:US06433541B1

    公开(公告)日:2002-08-13

    申请号:US09633198

    申请日:2000-08-07

    IPC分类号: G01B706

    CPC分类号: G01N27/72

    摘要: Disclosed is a method of obtaining information in-situ regarding a film of a sample using an eddy probe during a process for removing the film. The eddy probe has at least one sensing coil. An AC voltage is applied to the sensing coil(s) of the eddy probe. One or more first signals are measured in the sensing coil(s) of the eddy probe when the sensing coil(s) are positioned proximate the film of the sample. One or more second signals are measured in the sensing coil(s) of the eddy probe when the sensing coil(s) are positioned proximate to a reference material having a fixed composition and/or distance from the sensing coil. The first signals are calibrated based on the second signals so that undesired gain and/or phase changes within the first signals are corrected. A property value of the film is determined based on the calibrated first signals. An apparatus for performing the above described method is also disclosed.

    摘要翻译: 公开了一种在除去膜的过程中使用涡流探针在原位获取样品的膜的方法。 涡流探头具有至少一个感测线圈。 交流电压被施加到涡流探头的感测线圈上。 当感测线圈靠近样品的膜定位时,在涡流探针的感测线圈中测量一个或多个第一信号。 当感测线圈靠近具有与感测线圈的固定成分和/或距离的参考材料定位时,在涡流探针的感测线圈中测量一个或多个第二信号。 第一信号基于第二信号进行校准,从而校正第一信号内的不期望的增益和/或相位变化。 基于校准的第一信号确定胶片的属性值。 还公开了一种用于执行上述方法的装置。

    In-situ metalization monitoring using eddy current and optical measurements
    2.
    发明授权
    In-situ metalization monitoring using eddy current and optical measurements 有权
    使用涡流和光学测量进行原位金属化监测

    公开(公告)号:US06707540B1

    公开(公告)日:2004-03-16

    申请号:US09633800

    申请日:2000-08-07

    IPC分类号: G01N2100

    CPC分类号: G01N27/72

    摘要: Disclosed is a chemical mechanical polishing (CMP) system for polishing a sample with a polishing agent and monitoring the sample. The CMP system includes a polishing table, a sample carrier arranged to hold the sample over the polishing table, and an eddy probe. The polishing table and sample carrier are arranged to receive a polishing agent between the sample and the polishing table and to polish the sample by moving the polishing table and the sample carrier relative to each other. The eddy probe is arranged to be operable to obtain a measurement of the sample while the sample is being polished. The CMP system further includes an optical measurement device arranged to be operable to obtain a measurement of the sample while the sample is being polished. The CMP system also has a memory and a processor coupled with the memory. The processor and memory are adapted for operating the eddy probe and optical measurement device.

    摘要翻译: 公开了一种用抛光剂抛光样品并监测样品的化学机械抛光(CMP)系统。 CMP系统包括抛光台,布置成将样品保持在抛光台上的样品载体和涡流探针。 抛光台和样品载体布置成在样品和抛光台之间接收抛光剂,并通过相对于彼此移动抛光台和样品载体来抛光样品。 涡流探针布置成可操作以在样品被抛光时获得样品的测量。 CMP系统还包括光学测量装置,其布置成可操作以在样品被抛光时获得样品的测量。 CMP系统还具有与存储器耦合的存储器和处理器。 处理器和存储器适于操作涡流探针和光学测量装置。

    In-situ metalization monitoring using eddy current measurements during the process for removing the film
    3.
    发明授权
    In-situ metalization monitoring using eddy current measurements during the process for removing the film 有权
    在去除薄膜的过程中使用涡流测量进行原位金属化监测

    公开(公告)号:US06885190B2

    公开(公告)日:2005-04-26

    申请号:US10623953

    申请日:2003-07-21

    IPC分类号: G01N27/72 G01R33/12

    CPC分类号: G01N27/72

    摘要: A method for measuring conductance of a sample using an eddy current probe with a sensing coil. The method includes N repetitions of measuring first and second voltage pairs including in-phase and quadrature components of an induced AC voltage in the sensing coil, calibrating the first signal based on the measured second signal at a different separation from the sample and reference material, determining a conductance function relating conductance with location along the selected curve, processing the calibrated first voltage pairs to generate a lift-off curve, determining an intersection voltage pair representing intersection of the lift-off curve with a selected curve, and determining the conductance of the sample from the intersection voltage pair and the conductance function.

    摘要翻译: 使用具有感测线圈的涡流探头测量样品的电导率的方法。 该方法包括测量包括感测线圈中的感应AC电压的同相和正交分量的第一和第二电压对的N次重复,基于在与样本和参考材料不同的分离处测量的第二信号来校准第一信号, 确定与所选择的曲线相关的电导与位置的电导函数,处理校准的第一电压对以产生剥离曲线,确定表示取出曲线与选定曲线的交点的交叉电压对,以及确定 来自交点电压对的样本和电导函数。

    In-situ metalization monitoring using eddy current measurements during the process for removing the film
    4.
    发明授权
    In-situ metalization monitoring using eddy current measurements during the process for removing the film 有权
    在去除薄膜的过程中使用涡流测量进行原位金属化监测

    公开(公告)号:US06621264B1

    公开(公告)日:2003-09-16

    申请号:US10166585

    申请日:2002-06-05

    IPC分类号: G01B706

    CPC分类号: G01N27/72

    摘要: A method for measuring conductance of a sample using an eddy current probe with a sensing coil. The method includes N repetitions of measuring first and second voltage pairs including in-phase and quadrature components of an induced AC voltage in the sensing coil, calibrating the first signal based on the measured second signal at a different separation from the sample and reference material, determining a conductance function relating conductance with location along the selected curve, processing the calibrated first voltage pairs to generate a lift-off curve, determining an intersection voltage pair representing intersection of the lift-off curve with a selected curve, and determining the conductance of the sample from the intersection voltage pair and the conductance function.

    摘要翻译: 使用具有感测线圈的涡流探头测量样品的电导率的方法。 该方法包括测量包括感测线圈中的感应AC电压的同相和正交分量的第一和第二电压对的N次重复,基于在与样本和参考材料不同的分离处测量的第二信号来校准第一信号, 确定与所选择的曲线相关的电导与位置的电导函数,处理校准的第一电压对以产生剥离曲线,确定表示取出曲线与选定曲线的交点的交叉电压对,以及确定 来自交点电压对的样本和电导函数。

    Apparatus and methods for performing self-clearing optical measurements
    6.
    发明授权
    Apparatus and methods for performing self-clearing optical measurements 有权
    用于执行自清除光学测量的装置和方法

    公开(公告)号:US06628397B1

    公开(公告)日:2003-09-30

    申请号:US09396143

    申请日:1999-09-15

    IPC分类号: G01N2155

    摘要: Disclosed is a self-clearing objective for directing a beam towards a sample and clearing away debris from an optical viewing path adjacent to the sample. The self-clearing objective includes an optical element and a substantially transparent fluid flowing between the optical element and the sample such that at least a portion adjacent to the sample is substantially cleared of debris. The optical element and the fluid cooperatively direct the beam towards the sample. This self-clearing objective may be coupled with various measurement devices to measure various characteristics of samples having debris that prevents clear optical measurements. Additionally, the measurement device may be integrated with or coupled to various sample processing systems so that the relevant process may be clearly monitored.

    摘要翻译: 公开了一种用于将光束引向样品并从邻近样品的光学观察路径清除碎屑的自清除目标。 自清除物镜包括在光学元件和样品之间流动的光学元件和基本上透明的流体,使得与样品相邻的至少一部分基本上被清除。 光学元件和流体协调地将光束引向样品。 这种自清除物镜可以与各种测量装置耦合,以测量具有防止清晰光学测量的碎片的样品的各种特性。 此外,测量装置可以与各种样品处理系统集成或耦合到可以清楚地监测相关过程。

    Environmental damage reduction
    7.
    发明授权
    Environmental damage reduction 有权
    环境损害减少

    公开(公告)号:US07096752B1

    公开(公告)日:2006-08-29

    申请号:US10979489

    申请日:2004-11-02

    申请人: Kurt R. Lehman

    发明人: Kurt R. Lehman

    IPC分类号: G01M19/00

    摘要: A substrate processor that processes and inspects a substrate. A substrate handler moves a substrate within the substrate processor. A processing chamber receives the substrate from the substrate handler, and processes the substrate using damaging material that is retained to some extent by the substrate. An inspection tool receives the substrate from the substrate handler after the substrate has been processed. A controlled environment surrounds at least a portion of the inspection tool and the substrate. A purge gas supply provides a purge gas at a flow rate. A moisture control unit adjusts the purge gas to a relative humidity, and gas inlets direct the purge gas into the controlled environment.

    摘要翻译: 处理和检查基板的基板处理器。 衬底处理器移动衬底处理器内的衬底。 处理室从衬底处理器接收衬底,并使用由衬底在一定程度上保持的损坏材料来处理衬底。 在处理基板之后,检查工具从基板处理器接收基板。 受控环境围绕检查工具和基底的至少一部分。 吹扫气体供应以流量提供净化气体。 湿度控制单元将净化气体调节到相对湿度,并且气体入口将吹扫气体引导到受控环境中。