Invention Grant
- Patent Title: Vacuum suction membrane for holding silicon wafer
- Patent Title (中): 用于保持硅晶片的真空吸膜
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Application No.: US10109015Application Date: 2002-03-28
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Publication No.: US07070490B2Publication Date: 2006-07-04
- Inventor: Tzu-Shin Chen , Ming-Hsing Kao , Wen-Chin Lin , Hua-Bin Chi
- Applicant: Tzu-Shin Chen , Ming-Hsing Kao , Wen-Chin Lin , Hua-Bin Chi
- Applicant Address: TW Hsinchu
- Assignee: United Microelectronics Corp.
- Current Assignee: United Microelectronics Corp.
- Current Assignee Address: TW Hsinchu
- Agency: J.C. Patents
- Priority: TW91102579A 20020215
- Main IPC: B24B5/00
- IPC: B24B5/00
Abstract:
A membrane for vacuum suction of a silicon water typically used inside a polishing head. The membrane has a flat main body and a plurality of protrusions each having a spiny shape over the surface of the flat main body. The protrusions are formed in positions that correspond to the holes of a supporting multiple-hole panel. The protrusions on the flat main body lower the suction pressure between the wafer and the membrane somewhat so that wafer unloading failure is minimized.
Public/Granted literature
- US20030157870A1 Vacuum suction membrane for holding silicon wafer Public/Granted day:2003-08-21
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