Invention Grant
- Patent Title: Memory module
- Patent Title (中): 内存模块
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Application No.: US10853353Application Date: 2004-05-26
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Publication No.: US07072201B2Publication Date: 2006-07-04
- Inventor: Byung-se So , Jeong-hyeon Cho , Jung-joon Lee , Jae-jun Lee
- Applicant: Byung-se So , Jeong-hyeon Cho , Jung-joon Lee , Jae-jun Lee
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2003-0056012 20030813
- Main IPC: G11C5/06
- IPC: G11C5/06
Abstract:
In the memory module, a buffer is disposed on one of at least two circuit boards in the memory module. The buffer is for buffering signals for memory chips on at least two circuit boards in the memory module.
Public/Granted literature
- US20050036350A1 Memory module Public/Granted day:2005-02-17
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