Invention Grant
- Patent Title: System and method for multi-project wafer shuttle service
- Patent Title (中): 多项目晶圆穿梭服务的系统和方法
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Application No.: US10750750Application Date: 2004-01-02
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Publication No.: US07073160B2Publication Date: 2006-07-04
- Inventor: Jen-Lin Chao , Chin Yung Chang
- Applicant: Jen-Lin Chao , Chin Yung Chang
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Thomas, Kayden, Horstemeyer & Risley
- Main IPC: G06F17/50
- IPC: G06F17/50 ; G06F19/00

Abstract:
A system and method for MPW shuttle service. The system includes at least a first MPW shuttle reserving for a first group of device designs, a second MPW shuttle reserving for a second group of device designs, and a checking unit. The checking unit determines whether mask data for the first group has been provided by a cut off date for the first MPW shuttle, and exchanges a first target device design from the first group with a second target device design from the second group if the mask data of the first target device design has not been provided and that of the second target device design has been provided by the cut off date.
Public/Granted literature
- US20050149899A1 System and method for multi-project wafer shuttle service Public/Granted day:2005-07-07
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