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US07078303B2 Method for manufacturing semiconductor device having thick insulating layer under gate side walls 有权
在栅极侧壁上具有厚绝缘层的半导体器件的制造方法

Method for manufacturing semiconductor device having thick insulating layer under gate side walls
Abstract:
A semiconductor device includes a semiconductor substrate, a silicon oxide layer formed on the semiconductor substrate, a gate electrode formed over the silicon oxide layer, and a side wall structure formed over the silicon oxide layer and adjacent the gate electrode. In one configuration, the thickness of the silicon oxide layer under the sidewall structure is thicker than the thickness of the silicon oxide layer under the gate electrode.
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