发明授权
- 专利标题: Substrate joining apparatus
- 专利标题(中): 基板接合装置
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申请号: US10875165申请日: 2004-06-25
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公开(公告)号: US07078316B2公开(公告)日: 2006-07-18
- 发明人: Saburo Miyamoto , Yukitoshi Hase , Masaru Irie
- 申请人: Saburo Miyamoto , Yukitoshi Hase , Masaru Irie
- 申请人地址: JP Osaka
- 专利权人: Nitto Denko Corporation
- 当前专利权人: Nitto Denko Corporation
- 当前专利权人地址: JP Osaka
- 代理机构: Rader, Fishman & Grauer PLLC
- 优先权: JP2003-274047 20030714
- 主分类号: H01L21/30
- IPC分类号: H01L21/30
摘要:
A joining roller rolls on the surface of a reinforcing substrate held by a center and side latch claws so as to be close and opposite to an wafer placed and held on a holding table in the condition that an adhesive sheet is adhered on the surface, whereby joining proceeds. As the joining roller rolls, both of the latch claws oscillate downward and the latch claws themselves move down while keeping the bend of the reinforcing substrate nearly constant, and retract when the joining roller approaches the latch claws.
公开/授权文献
- US20050014345A1 Substrate joining method and apparatus 公开/授权日:2005-01-20
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