公开(公告)号：US07078316B2

公开(公告)日：2006-07-18

申请号：US10875165

申请日：2004-06-25

申请人： Saburo Miyamoto ,  Yukitoshi Hase ,  Masaru Irie

发明人： Saburo Miyamoto ,  Yukitoshi Hase ,  Masaru Irie

IPC分类号： H01L21/30

CPC分类号： H01L21/67132 ,  H01L21/67092

摘要： A joining roller rolls on the surface of a reinforcing substrate held by a center and side latch claws so as to be close and opposite to an wafer placed and held on a holding table in the condition that an adhesive sheet is adhered on the surface, whereby joining proceeds. As the joining roller rolls, both of the latch claws oscillate downward and the latch claws themselves move down while keeping the bend of the reinforcing substrate nearly constant, and retract when the joining roller approaches the latch claws.

摘要翻译： 接合辊在由粘合在表面上的粘合片的条件下，在由中央和侧面的锁定爪保持的加强基板的表面上滚动以与放置并保持在保持台上的晶片紧密相对，由此 加入收益 当接合辊滚动时，两个闩锁爪向下摆动，并且闩爪自身向下运动，同时保持加强基板的弯曲几乎恒定，并且当接合辊接近闩锁爪时缩回。

公开(公告)号：US20050014345A1

公开(公告)日：2005-01-20

申请号：US10875165

申请日：2004-06-25

申请人： Saburo Miyamoto ,  Yukitoshi Hase ,  Masaru Irie

发明人： Saburo Miyamoto ,  Yukitoshi Hase ,  Masaru Irie

IPC分类号： H01L21/683 ,  H01L21/00 ,  H01L21/02 ,  H01L21/301 ,  H01L21/304 ,  H01L21/52 ,  H01L21/30 ,  H01L21/3205

CPC分类号： H01L21/67132 ,  H01L21/67092

摘要： A joining roller rolls on the surface of a reinforcing substrate held by a center and side latch claws so as to be close and opposite to an wafer placed and held on a holding table in the condition that an adhesive sheet is adhered on the surface, whereby joining proceeds. As the joining roller rolls, both of the latch claws oscillate downward and the latch claws themselves move down while keeping the bend of the reinforcing substrate nearly constant, and retract when the joining roller approaches the latch claws.

摘要翻译： 接合辊在由粘合在表面上的粘合片的条件下，在由中央和侧面的锁定爪保持的加强基板的表面上滚动以与放置并保持在保持台上的晶片紧密相对，由此 加入收益 当接合辊滚动时，两个闩锁爪向下摆动，并且闩爪自身向下运动，同时保持加强基板的弯曲几乎恒定，并且当接合辊接近闩锁爪时缩回。

公开(公告)号：US07393757B2

公开(公告)日：2008-07-01

申请号：US10939429

申请日：2004-09-14

申请人： Saburo Miyamoto ,  Yukitoshi Hase

发明人： Saburo Miyamoto ,  Yukitoshi Hase

IPC分类号： H01L21/78

CPC分类号： B32B43/006 ,  B32B2457/14 ,  H01L21/67109 ,  H01L21/67132 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834

摘要： A work is suction-held by an upper suction chuck stage from the surface side of a supporting member, is moved upward to a predetermined height, and is heated in a state where the thickness direction of a both-faced adhesive sheet is not restricted, and a dicing tape is cooled. After lapse of predetermined heating time, the work is separated from the both-faced adhesive sheet whose adhesive strength is weaken, and drops to a lower suction chuck stage.

摘要翻译： 工件由支撑构件的表面侧的上部吸力卡盘台抽吸，向上移动到预定高度，并且在两面粘合片的厚度方向不受限制的状态下被加热， 并且切割胶带被冷却。 在经过预定的加热时间之后，将工件与粘合强度减弱的双面粘合片分离，并且下降到较低的吸力卡盘台。

公开(公告)号：US07384811B2

公开(公告)日：2008-06-10

申请号：US10938645

申请日：2004-09-13

申请人： Saburo Miyamoto ,  Yukitoshi Hase

发明人： Saburo Miyamoto ,  Yukitoshi Hase

IPC分类号： H01L21/00 ,  H01L21/46

CPC分类号： H01L21/67132

摘要： With respect to a work obtained by joining a semiconductor wafer and a supporting member to each other via a both-faced adhesive sheet having heating separability, the surface of the supporting member is suction-held at a suction stage and is heated, thereby making the adhesive strength of an adhesive layer almost disappear. A Bernoulli chuck is moved close from the back side of the semiconductor wafer to separate the semiconductor wafer in a non-contact manner and to suspension-hold the semiconductor wafer in a state where the semiconductor wafer floats in the air.

摘要翻译： 关于通过具有加热分离性的双面粘合片将半导体晶片和支撑构件彼此接合而获得的功，将支撑构件的表面吸引保持在抽吸阶段并被加热， 粘合剂层的粘合强度几乎消失。 伯努利卡盘从半导体晶片的背面靠近移动，以非接触的方式分离半导体晶片，并且在半导体晶片浮在空气中的状态下悬挂保持半导体晶片。

公开(公告)号：US20110048609A1

公开(公告)日：2011-03-03

申请号：US12848290

申请日：2010-08-02

申请人： Saburo Miyamoto ,  Yukitoshi Hase ,  Masayuki Yamamoto

发明人： Saburo Miyamoto ,  Yukitoshi Hase ,  Masayuki Yamamoto

IPC分类号： B32B37/12 ,  B32B38/04

CPC分类号： B65H35/0013 ,  B65H37/002 ,  B65H2301/460186 ,  Y10T156/108 ,  Y10T156/1084 ,  Y10T156/1085 ,  Y10T156/1195

摘要： A joint detector detects a joint in an adhesive tape supplied from a tape supply section, and a computing unit determines a suitable cutting position of the adhesive tape for removing the joint in accordance with the detected results. A controller controls each mechanism to operate so as to satisfy the determined results by the computing unit. Thereafter, the adhesive tape including the joint is cut and removed.

摘要翻译： 联合检测器检测从带供应部分提供的粘合带中的接头，并且计算单元根据检测结果确定用于移除接头的胶带的适当切割位置。 控制器控制每个机构进行操作以满足计算单元确定的结果。 此后，将包括接头的胶带切割并除去。

公开(公告)号：US20050074952A1

公开(公告)日：2005-04-07

申请号：US10938645

申请日：2004-09-13

申请人： Saburo Miyamoto ,  Yukitoshi Hase

发明人： Saburo Miyamoto ,  Yukitoshi Hase

IPC分类号： B65G49/07 ,  H01L21/00 ,  H01L21/301 ,  H01L21/304 ,  H01L21/60 ,  H01L21/677 ,  H01L21/683 ,  H01L21/30 ,  H01L21/46

CPC分类号： H01L21/67132

摘要： With respect to a work obtained by joining a semiconductor wafer and a supporting member to each other via a both-faced adhesive sheet having heating separability, the surface of the supporting member is suction-held at a suction stage and is heated, thereby making the adhesive strength of an adhesive layer almost disappear. A Bernoulli chuck is moved close from the back side of the semiconductor wafer to separate the semiconductor wafer in a non-contact manner and to suspension-hold the semiconductor wafer in a state where the semiconductor wafer floats in the air.

摘要翻译： 关于通过具有加热分离性的双面粘合片将半导体晶片和支撑构件彼此接合而获得的功，将支撑构件的表面吸引保持在抽吸阶段并被加热， 粘合剂层的粘合强度几乎消失。 伯努利卡盘从半导体晶片的背面靠近移动，以非接触的方式分离半导体晶片，并且在半导体晶片浮在空气中的状态下悬挂保持半导体晶片。

公开(公告)号：US08349106B2

公开(公告)日：2013-01-08

申请号：US12848290

申请日：2010-08-02

申请人： Saburo Miyamoto ,  Yukitoshi Hase ,  Masayuki Yamamoto

发明人： Saburo Miyamoto ,  Yukitoshi Hase ,  Masayuki Yamamoto

IPC分类号： B32B41/00

CPC分类号： B65H35/0013 ,  B65H37/002 ,  B65H2301/460186 ,  Y10T156/108 ,  Y10T156/1084 ,  Y10T156/1085 ,  Y10T156/1195

摘要： A joint detector detects a joint in an adhesive tape supplied from a tape supply section, and a computing unit determines a suitable cutting position of the adhesive tape for removing the joint in accordance with the detected results. A controller controls each mechanism to operate so as to satisfy the determined results by the computing unit. Thereafter, the adhesive tape including the joint is cut and removed.

摘要翻译： 联合检测器检测从带供应部分提供的粘合带中的接头，并且计算单元根据检测结果确定用于移除接头的胶带的适当切割位置。 控制器控制每个机构进行操作以满足计算单元确定的结果。 此后，将包括接头的胶带切割并除去。

公开(公告)号：US20110056615A1

公开(公告)日：2011-03-10

申请号：US12861016

申请日：2010-08-23

申请人： Saburo Miyamoto ,  Yukitoshi Hase ,  Masayuki Yamamoto

发明人： Saburo Miyamoto ,  Yukitoshi Hase ,  Masayuki Yamamoto

IPC分类号： B29C65/50 ,  B32B37/12 ,  B32B37/02 ,  B32B38/00

CPC分类号： B65H35/0013 ,  B29C53/36 ,  B29C63/0056 ,  Y10T156/1015

摘要： A nipper formed of a pair of nip blocks in an open state suction-holds on nip surfaces thereof a front end of the adhesive tape that is folded back with an edge member and separated from a separator. Then, the nip block on a front end side pivots to unite the nip surfaces of the nip blocks to each other. As a result, the adhesive tape is bent inwardly and adhesive layers thereof are adhered to each other to form a tab. The nip block on a rear end side suction-holds a rear end of the cut adhesive tape. Then, the nip block on the rear end side pivots to bend the adhesive tape inwardly for forming a tab.

摘要翻译： 由打开状态的一对夹块形成的夹持器在其压合表面上保持着由边缘构件折回并与分离器分离的胶带的前端。 然后，前端侧的夹持块枢转，将夹持块的夹持面彼此结合。 结果，胶带向内弯曲并且其粘合剂层彼此粘合以形成凸片。 后端侧的夹持块吸住切割的胶带的后端。 然后，后端侧的压区块向内转动以使粘合带向内弯曲以形成突出部。

公开(公告)号：US20050032332A1

公开(公告)日：2005-02-10

申请号：US10939429

申请日：2004-09-14

申请人： Saburo Miyamoto ,  Yukitoshi Hase

发明人： Saburo Miyamoto ,  Yukitoshi Hase

IPC分类号： H01L21/67 ,  B32B43/00 ,  B65H41/00 ,  H01L21/00 ,  H01L21/30 ,  H01L21/301 ,  H01L21/304 ,  H01L21/68 ,  H01L21/78

CPC分类号： B32B43/006 ,  B32B2457/14 ,  H01L21/67109 ,  H01L21/67132 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834

摘要： A work is suction-held by an upper suction chuck stage from the surface side of a supporting member, is moved upward to a predetermined height, and is heated in a state where the thickness direction of a both-faced adhesive sheet is not restricted, and a dicing tape is cooled. After lapse of predetermined heating time, the work is separated from the both-faced adhesive sheet whose adhesive strength is weaken, and drops to a lower suction chuck stage.

摘要翻译： 工件由支撑构件的表面侧的上部吸力卡盘台抽吸，向上移动到预定高度，并且在两面粘合片的厚度方向不受限制的状态下被加热， 并且切割胶带被冷却。 在经过预定的加热时间之后，将工件与粘合强度减弱的双面粘合片分离，并且下降到较低的吸力卡盘台。

公开(公告)号：US20110045234A1

公开(公告)日：2011-02-24

申请号：US12834450

申请日：2010-07-12

申请人： Saburo Miyamoto ,  Yukitoshi Hase ,  Masayuki Yamamoto

发明人： Saburo Miyamoto ,  Yukitoshi Hase ,  Masayuki Yamamoto

IPC分类号： B32B7/12 ,  B32B38/10

CPC分类号： B62D25/105 ,  Y10T156/1077 ,  Y10T428/24174

摘要： A joining roller rolls while pressing on a separator on a surface of a double-faced adhesive tape with through holes in rectangular shapes regularly formed therein in a longitudinal tape direction, and the double-faced adhesive tape is joined to a building panel. Thereafter, the separator is separated and the reinforcing member is joined to an adhesive layer of the double-faced adhesive tape while being pressed with the reinforcing member being kept parallel to the double-faced adhesive tape.

摘要翻译： 接合辊在将双面胶带的表面上的隔膜压在辊纵向上规则地形成有矩形形状的通孔的同时滚压，双面胶带与建筑面板接合。 此后，分离器被分离，并且加强构件在与加强构件保持平行于双面胶带的同时被按压而与双面胶带的粘合剂层接合。