发明授权
- 专利标题: Reduced dielectric constant spacer materials integration for high speed logic gates
- 专利标题(中): 降低介电常数间隔材料集成用于高速逻辑门
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申请号: US10709652申请日: 2004-05-20
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公开(公告)号: US07081393B2公开(公告)日: 2006-07-25
- 发明人: Michael P. Belyansky , Joyce C. Liu , Hsing Jen Wann , Richard Stephen Wise , Hongwen Yan
- 申请人: Michael P. Belyansky , Joyce C. Liu , Hsing Jen Wann , Richard Stephen Wise , Hongwen Yan
- 申请人地址: US NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: US NY Armonk
- 代理商 Howard M. Cohn; H. Daniel Schnurmann
- 主分类号: H01L21/336
- IPC分类号: H01L21/336
摘要:
An FET transistor has a gate disposed between a source and a drain; a gate dielectric layer disposed underneath the gate; and a spacer on a side of the gate. The gate dielectric layer is conventional oxide and the spacer has a reduced dielectric constant (k). The reduced dielectric constant (k) may be less than 3.85, or it may be less than 7.0 (˜nitride), but greater than 3.85 (˜oxide). Preferably, the spacer comprises a material which can be etched selectively to the gate dielectric layer. The spacer may be porous, and a thin layer is deposited on the porous spacer to prevent moisture absorption. The spacer may comprise a material selected from the group consisting of Black Diamond, Coral, TERA and Blok type materials. Pores may be formed in the spacer material by exposing the spacers to an oxygen plasma.
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