发明授权
- 专利标题： Method of manufacturing a microcomponent assembly
- 专利标题（中）： 微型组件的制造方法
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申请号： US10616735申请日： 2003-07-10
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公开(公告)号： US07096568B1公开(公告)日： 2006-08-29
- 发明人: Erik Nilsen , Matthew D. Ellis , Charles L. Goldsmith , Jeong Bong Lee , Xiaojun Huang , Arun Kumar Nallani , Kabseog Kim , George D. Skidmore
- 申请人： Erik Nilsen , Matthew D. Ellis , Charles L. Goldsmith , Jeong Bong Lee , Xiaojun Huang , Arun Kumar Nallani , Kabseog Kim , George D. Skidmore
- 申请人地址： US TX Richardson
- 专利权人： Zyvex Corporation
- 当前专利权人： Zyvex Corporation
- 当前专利权人地址： US TX Richardson
- 代理机构： Haynes and Boone, LLP
- 主分类号： H05B3/00
- IPC分类号： H05B3/00
摘要：
A new process and structure for microcomponent interconnection utilizing a post-assembly activated junction compound. In one embodiment, first and second microcomponents having respective first and second contact areas are provided. A junction compound is formed on one of the first and second contact areas, and the first and second contact areas are positioned adjacent each other on opposing sides of the junction compound. The junction compound is then activated to couple the first and second microcomponents.
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