发明授权
- 专利标题： Integrated circuit package electrical enhancement with improved lead frame design
- 专利标题（中）： 集成电路封装电气增强，改进了引线框设计
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申请号： US10633851申请日： 2003-08-04
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公开(公告)号： US07098527B2公开(公告)日： 2006-08-29
- 发明人: David J. Corisis , Jerry M. Brooks
- 申请人： David J. Corisis , Jerry M. Brooks
- 申请人地址： US ID Boise
- 专利权人： Micron Technology, Inc.
- 当前专利权人： Micron Technology, Inc.
- 当前专利权人地址： US ID Boise
- 代理机构： TraskBritt
- 主分类号： H01L23/495
- IPC分类号： H01L23/495
摘要：
A configuration for a conventional lead frame for conserving limited leads and for allowing the location of bond pads anywhere on the periphery of the semiconductor device and for reducing the cost of tooling changes by permitting the use of current tooling. The present invention utilizes an extended lead finger that extends along the periphery of a semiconductor device to provide a power source or ground so that any number of bond pads may be used in any position without requiring additional leads or tooling changes.