Invention Grant
- Patent Title: Accelerometer
- Patent Title (中): 加速度计
-
Application No.: US10945889Application Date: 2004-09-22
-
Publication No.: US07100448B2Publication Date: 2006-09-05
- Inventor: Naokatsu Ikegami
- Applicant: Naokatsu Ikegami
- Applicant Address: JP Tokyo
- Assignee: Oki Electric Industry Co., Ltd.
- Current Assignee: Oki Electric Industry Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Rabin & Berdo, PC
- Priority: JP2003-379403 20031110
- Main IPC: G01P15/12
- IPC: G01P15/12

Abstract:
An accelerometer includes: a sensor chip including a weight portion for detecting a force imparted from outside, a frame portion that surrounds the weight portion, a beam portion that is deflectable and flexibly supports the weight portion, and a sensor element whose electric resistance varies depending on an amount by which the beam portion deflects; and a spacer provided at a position on a surface of a mounting substrate which position corresponds to the central portion of the weight portion. The sensor chip is mounted on the mounting substrate with a bottom surface of the frame portion being fixed at a predetermined position on the mounting substrate by an adhesive portion. The spacer has a thickness greater than that of the adhesive portion and may be formed by an adhesive concurrently with the adhesive portion, with a gap being maintained between the bottom surface of the weight portion and the spacer. The spacer serves to restrict an amount of downward movement of the weight portion which occurs when the beam portion deflects.
Public/Granted literature
- US20050097958A1 Accelerometer Public/Granted day:2005-05-12
Information query
IPC分类: