发明授权
- 专利标题： Electrolytic processing device and substrate processing apparatus
- 专利标题（中）： 电解处理装置及基板处理装置
-
申请号： US10337357申请日： 2003-01-07
-
公开(公告)号： US07101465B2公开(公告)日： 2006-09-05
- 发明人: Itsuki Kobata , Mitsuhiko Shirakashi , Masayuki Kumekawa , Takayuki Saito , Yasushi Toma , Tsukuru Suzuki , Kaoru Yamada , Yuji Makita , Hozumi Yasuda
- 申请人： Itsuki Kobata , Mitsuhiko Shirakashi , Masayuki Kumekawa , Takayuki Saito , Yasushi Toma , Tsukuru Suzuki , Kaoru Yamada , Yuji Makita , Hozumi Yasuda
- 申请人地址： JP Tokyo
- 专利权人： Ebara Corporation
- 当前专利权人： Ebara Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： Wenderoth, Lind & Ponack, L.L.P.
- 优先权： JP2002-000838 20020107; JP2002-126400 20020426
- 主分类号： C25D17/00
- IPC分类号： C25D17/00
摘要：
There is provided an electrolytic processing device including: a processing electrode to be brought into contact with or close to a workpiece; a feeding electrode for supplying electricity to the workpiece; an ion exchanger disposed in at least one of spaces between the workpiece and the processing electrode, and between the workpiece and the feeding electrode; a power source for applying a voltage between the processing electrode and the feeding electrode; and a liquid supply section for supplying a liquid to the space between the workpiece and at least one of the processing electrode and the feeding electrode, in which the ion exchanger is present. A substrate processing apparatus having the electrolytic processing device is also provided.
公开/授权文献
信息查询
