发明授权
US07105389B2 Method of manufacturing semiconductor device having impurity region under isolation region 有权
制造在隔离区域具有杂质区域的半导体器件的制造方法

Method of manufacturing semiconductor device having impurity region under isolation region
摘要:
In formation of a source/drain region of an NMOS transistor, a gate-directional extension region of an N+ block region in an N+ block resist film located under the gate-directional extension region from implantation of an N-type impurity. A high resistance forming region, which is the well region having a possibility for implantation of an N-type impurity on a longitudinal extension of a gate electrode , can be formed as a high resistance forming region narrower than a conventional high resistance forming region . Thus, a semiconductor device having a partially isolated body fixed SOI structure capable of reducing body resistance and a method of manufacturing the same are obtained.
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