Invention Grant
- Patent Title: Semiconductor fabrication using a collar
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Application No.: US10788977Application Date: 2004-02-27
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Publication No.: US07109089B2Publication Date: 2006-09-19
- Inventor: Kevin Torek , Kevin Shea , Niraj B. Rana , Zhiping Yin
- Applicant: Kevin Torek , Kevin Shea , Niraj B. Rana , Zhiping Yin
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Schwegman, Lundberg, Woessner & Kluth, P.A.
- Main IPC: H01L21/20
- IPC: H01L21/20
Abstract:
In one embodiment, a method includes selectively depositing a collar material between a number of memory containers. The collar material along a side of a first memory container of the number of memory containers is in contact with the collar material along a side of a second memory container. An opening exists between the collar material along a corner of the first memory container and the collar material along a corner of a third memory container.
Public/Granted literature
- US20050191805A1 Semiconductor fabrication using a collar Public/Granted day:2005-09-01
Information query
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