- 专利标题： Electrochemical fabrication methods including use of surface treatments to reduce overplating and/or planarization during formation of multi-layer three-dimensional structures
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申请号： US10841100申请日： 2004-05-07
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公开(公告)号： US07109118B2公开(公告)日： 2006-09-19
- 发明人: Adam L. Cohen , Dennis R. Smalley , Michael S. Lockard , Qui T. Le
- 申请人： Adam L. Cohen , Dennis R. Smalley , Michael S. Lockard , Qui T. Le
- 申请人地址： US CA Van Nuys
- 专利权人： Microfabrica Inc.
- 当前专利权人： Microfabrica Inc.
- 当前专利权人地址： US CA Van Nuys
- 代理商 Dennis R. Smalley
- 主分类号： H01L21/311
- IPC分类号： H01L21/311
摘要：
A method of fabricating three-dimensional structures from a plurality of adhered layers of at least a first and a second material wherein the first material is a conductive material and wherein each of a plurality of layers includes treating a surface of a first material prior to deposition of the second material. The treatment of the surface of the first material either (1) decreases the susceptibility of deposition of the second material onto the surface of the first material or (2) eases or quickens the removal of any second material deposited on the treated surface of the first material. In some embodiments the treatment of the first surface includes forming a dielectric coating over the surface and the second material is electrodeposited (e.g. using an electroplating or electrophoretic process). In other embodiments the first material is coated with a conductive material that doesn't readily accept deposits of electroplated or electroless deposited materials.
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