Invention Grant
US07112314B2 Polymerization employing diacyl peroxide made in aprotic solvent
失效
使用在非质子溶剂中制备的二酰基过氧化物的聚合
- Patent Title: Polymerization employing diacyl peroxide made in aprotic solvent
- Patent Title (中): 使用在非质子溶剂中制备的二酰基过氧化物的聚合
-
Application No.: US10846793Application Date: 2004-05-14
-
Publication No.: US07112314B2Publication Date: 2006-09-26
- Inventor: Paul Douglas Brothers , Brian Edward Kipp , Charles Joseph Noelke , Ronald Earl Uschold , Robert Clayton Wheland
- Applicant: Paul Douglas Brothers , Brian Edward Kipp , Charles Joseph Noelke , Ronald Earl Uschold , Robert Clayton Wheland
- Applicant Address: US DE Wilmington
- Assignee: E. I. du Pont de Nemours and Company
- Current Assignee: E. I. du Pont de Nemours and Company
- Current Assignee Address: US DE Wilmington
- Main IPC: C11D1/00
- IPC: C11D1/00 ; C01B15/16
Abstract:
This invention relates to a process for the synthesis of diacyl peroxide by contacting acyl halide and peroxide complex in compatible aprotic solvent substantially free of compounds oxidizable by the peroxide complex or the reaction products of organic acyl halide with peroxide complex and the initiation of polymerization with diacyl peroxide in the aprotic solvent.
Public/Granted literature
- US20040213723A1 Polymerization employing diacyl peroxide made in aprotic solvent Public/Granted day:2004-10-28
Information query
