发明授权
US07115432B2 Base pattern forming material for electrode and wiring material absorption, electrode and wiring forming method, and method of manufacturing image forming apparatus
失效
用于电极和布线材料吸收的基底图案形成材料，电极和布线形成方法以及制造图像形成装置的方法
- 专利标题： Base pattern forming material for electrode and wiring material absorption, electrode and wiring forming method, and method of manufacturing image forming apparatus
- 专利标题（中）： 用于电极和布线材料吸收的基底图案形成材料，电极和布线形成方法以及制造图像形成装置的方法
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申请号： US10627645申请日： 2003-07-28
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公开(公告)号： US07115432B2公开(公告)日： 2006-10-03
- 发明人: Kazuhiro Kagami , Masahiro Terada , Shosei Mori , Tsuyoshi Furuse
- 申请人： Kazuhiro Kagami , Masahiro Terada , Shosei Mori , Tsuyoshi Furuse
- 申请人地址： JP Tokyo
- 专利权人： Canon Kabushiki Kaisha
- 当前专利权人： Canon Kabushiki Kaisha
- 当前专利权人地址： JP Tokyo
- 代理机构： Fitzpatrick, Cella, Harper & Scinto
- 优先权： JP2002-227006 20020805
- 主分类号： H01L21/00
- IPC分类号： H01L21/00
摘要：
A fine electrode and wiring pattern with a good adhesive property is easily formed using a water-based solution easy to handle and small in environmental load, thereby improving a stability of a manufacturing process of an image-forming apparatus in the case where the water-based solution is used in the manufacturing process. A base pattern is formed using a base pattern forming material for electrode and wiring material absorption which is a water-based solution containing a water-soluble photosensitive resin component and a water-soluble metallic compound including rhodium, bismuth, ruthenium, vanadium, chromium, tin, lead, or silicon. An organic metallic compound is absorbed in the base pattern and then baking is conducted to form electrodes and wirings.
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