Invention Grant
- Patent Title: Method of depositing dielectric films
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Application No.: US11358793Application Date: 2006-02-21
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Publication No.: US07117064B2Publication Date: 2006-10-03
- Inventor: Srinivas D Nemani , Li-Qun Xia , Dian Sugiarto , Ellie Yieh , Ping Xu , Francimar Campana-Schmitt , Jia Lee
- Applicant: Srinivas D Nemani , Li-Qun Xia , Dian Sugiarto , Ellie Yieh , Ping Xu , Francimar Campana-Schmitt , Jia Lee
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson and Sheridan
- Main IPC: G06F19/00
- IPC: G06F19/00 ; C23C16/00 ; H05H1/24 ; H01L21/31 ; H01L21/469

Abstract:
A method of forming a silicon carbide layer for use in integrated circuit fabrication processes is provided. The silicon carbide layer is formed by reacting a gas mixture comprising a silicon source, a carbon source, and a dopant in the presence of an electric field. The as-deposited silicon carbide layer has a compressibility that varies as a function of the amount of dopant present in the gas mixture during later formation.
Public/Granted literature
- US20060141805A1 Method of depositing dielectric films Public/Granted day:2006-06-29
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