- 专利标题: Chemical vapor deposition chamber pre-deposition treatment for improved carbon doped oxide thickness uniformity and throughput
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申请号: US10154897申请日: 2002-05-23
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公开(公告)号: US07125583B2公开(公告)日: 2006-10-24
- 发明人: Ebrahim Andideh , Kevin L. Peterson , Jeff Bielefeld
- 申请人: Ebrahim Andideh , Kevin L. Peterson , Jeff Bielefeld
- 申请人地址: US CA Santa Clara
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: US CA Santa Clara
- 代理商 Rahul D. Engineer
- 主分类号: C23C16/40
- IPC分类号: C23C16/40 ; H05H1/24
摘要:
A method for improving thickness uniformity and throughput of a carbon doped oxide deposition process is described. That method comprises removing pre-deposition steps in a deposition phase. Moreover, helium plasma is added to a pre-clean phase to eliminate the production of dummy wafers.
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