Invention Grant
- Patent Title: Bus signaling through electromagnetic couplers having different coupling strengths at different locations
- Patent Title (中): 通过电磁耦合器在不同位置具有不同耦合强度的总线信令
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Application No.: US10165096Application Date: 2002-06-05
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Publication No.: US07126437B2Publication Date: 2006-10-24
- Inventor: Thomas D. Simon , Rajeevan Amirtharajah , John R. Benham
- Applicant: Thomas D. Simon , Rajeevan Amirtharajah , John R. Benham
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agent Philip A. Pedigo
- Main IPC: H01P5/04
- IPC: H01P5/04
Abstract:
Electromagnetic coupling locations are provided along a bus. Devices can be respectively coupled at the locations for communication on the bus. Electromagnetic coupling strengths associated with at least some coupling locations are caused to have different, selected values.
Public/Granted literature
- US20030227346A1 Bus signaling through electromagnetic couplers Public/Granted day:2003-12-11
Information query
