发明授权
US07128279B2 Method and apparatus for fluid delivery to a backside of a substrate
有权
用于流体输送到衬底背面的方法和装置
- 专利标题： Method and apparatus for fluid delivery to a backside of a substrate
- 专利标题（中）： 用于流体输送到衬底背面的方法和装置
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申请号： US10758029申请日： 2004-01-14
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公开(公告)号： US07128279B2公开(公告)日： 2006-10-31
- 发明人: John M. Boyd , Carl Woods
- 申请人： John M. Boyd , Carl Woods
- 申请人地址： US CA Fremont
- 专利权人： Lam Research Corporation
- 当前专利权人： Lam Research Corporation
- 当前专利权人地址： US CA Fremont
- 代理机构： Martine Penilla & Gencarella, LLP
- 主分类号： B05B3/00
- IPC分类号： B05B3/00
摘要：
A fluid delivery device for delivering fluid to the backside of a substrate while minimizing waste is provided. The device includes an inner cylindrical tube having a top opening and a bottom opening. An upper cap overlying a top portion of the inner cylindrical tube is included. The upper cap is moveably disposed over the inner cylindrical tube. The upper cap includes a top with at least one hole defined therein. The top includes a sidewall extending therefrom. A system and a method for reducing an amount of a cleaning chemistry applied to a backside of a wafer during a cleaning operation are also provided.