Invention Grant
- Patent Title: Furan-containing hole transporting materials
- Patent Title (中): 含呋喃的空穴传输材料
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Application No.: US10643041Application Date: 2003-08-18
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Publication No.: US07128983B2Publication Date: 2006-10-31
- Inventor: Tien-yau Luh , Lingzhi Zhang , Chin-Fa Lee , Chung-Chih Wu , Cheih-Wei Chen
- Applicant: Tien-yau Luh , Lingzhi Zhang , Chin-Fa Lee , Chung-Chih Wu , Cheih-Wei Chen
- Applicant Address: TW Taipei
- Assignee: Academia Sinica
- Current Assignee: Academia Sinica
- Current Assignee Address: TW Taipei
- Agency: Fish & Richardson P.C.
- Main IPC: H05B33/12
- IPC: H05B33/12 ; C07D307/02 ; H01L27/32 ; H01L51/50
Abstract:
A furan-containing compound of formula (I): Ar is aryl, heteroaryl, or oligoaryl; A is furyl; B is aryl or heteroaryl; R1 is hydrogen, alkenyl, alkynyl, aryl, heteroaryl, cyclyl, heterocyclyl, or oligoaryl; and R2 is hydrogen, alkyl, alkenyl, alkynyl, aryl, heteroaryl, cyclyl, or heterocyclyl. The compound is useful as a hole transporting material in an organic light emitting diode device.
Public/Granted literature
- US20040131883A1 Furan-containing hole transporting materials Public/Granted day:2004-07-08
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