Invention Grant
- Patent Title: Semiconductor device, semiconductor package for use therein, and manufacturing method thereof
- Patent Title (中): 半导体器件，其中使用的半导体封装及其制造方法
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Application No.: US10690627Application Date: 2003-10-23
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Publication No.: US07129587B2Publication Date: 2006-10-31
- Inventor: Takaaki Sasaki
- Applicant: Takaaki Sasaki
- Applicant Address: JP Tokyo
- Assignee: Oki Electric Industry Co., Ltd.
- Current Assignee: Oki Electric Industry Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: VolentineFrancos&Whitt,PLLC
- Priority: JP9-190818 19970716
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
A semiconductor package includes a substrate for mounting and fixing a semiconductor chip thereon and a connecting pattern. The substrate is provided with an elongate opening formed therein. The semiconductor chip is fixed with its surface being mounted on the substrate and with its electrode being aligned within the elongate opening. The electrode of the semiconductor chip is electrically connected to the connecting pattern via wires through the elongate opening. The elongate opening and the wires are sealed with resin.
Public/Granted literature
- US20040082102A1 Semiconductor device, semiconductor package for use therein, and manufacturing method thereof Public/Granted day:2004-04-29
Information query
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